New revision of interconnecting and packaging standard
12 August 2015
Manufacturing / Production Technology, Hardware & Services
News
IPC has released IPC-T-50 Revision M, ‘Terms and Definitions for Interconnecting and Packaging Electronic Circuits’. This ever evolving standard provides common language of terms and definitions for the electronics industry.
Each year, terms and definitions become relevant in the electronics industry and in the manufacturing process. To meet these needs, the latest revision gives users the most up-to-date descriptions and illustrations of electronic interconnect industry terminology.
IPC-T-50M delivers more than 150 new and revised terms, while also eliminating out-of-date terminology in order to provide a streamlined standard that focuses on the trending language of the electronics industry. Specifically, this revision includes terms often cited in other standards, such as conformal coating, statistical process control and stencil design.
According to John Perry, IPC director of printed board standards and technology, the association aims to update the IPC-T-50 standard as often as possible with significant terms and technology. “We want to keep the document relevant in today’s rapidly changing industry,” he explains. “To accomplish this, we solicited input from subject matter experts within the electronics industry who worked on standards such as the IPC-6012C, ‘Qualification and Performance Specification for Rigid Printed Boards,’ the IPC-6013C, ‘Qualification and Performance Specification for Flexible Printed Boards,’ the IPC-HDBK-830, ‘Guidelines for Design, Selection and Application of Conformal Coatings handbook,’ and the recent IPC-HDBK-850, ‘Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly handbook.’”
For more information visit www.ipc.org
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