Flexible printed electronics substrates
28 March 2024
Manufacturing / Production Technology, Hardware & Services
New LEXAN CXT film from SABIC offers high thermal process stability and transparency for demanding printed electronics substrates. Having a transparent high-heat film provides the flexibility and advantage needed to process under wider and more flexible process temperatures
The new polycarbonate-based technology combines superior optical clarity and high design flexibility with excellent thermal and dimensional stability at elevated process temperatures. The material was specially developed to provide a high-performance and cost-efficient solution for substrates in the rapidly-growing printed electronics market, and for other applications exposed to high processing or in-use temperatures.
Compared to other films available, the LEXAN has a thickness of 50 µm, yet the overall highest total transmittance is 89.5%. It is also the only film to have a yellowing index of 1, its nearest rival having an index rating of 8.2.
Potential applications for the high-heat LEXAN film include as a substrate for flexible printed circuits, and as a conductive coating for touch panels.
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