1 January 2018
Manufacturing / Production Technology, Hardware & Services
SEHO Systems recently launched a new entry-level selective soldering system featuring an electrodynamic soldering unit and a complete range of automated process control features.
The GoSelective-LS selective soldering system is designed for standalone production of small and medium sized volumes with a very compact footprint. To ensure an ergonomical work flow and the shortest cycle times, the system is equipped with a loading and unloading station for carriers up to 20” x 20”. Here, boards can be assembled in one carrier while a second carrier is being processed in the machine.
With the GoSelective-LS, all process steps are completely automated. The machine features a precise axis system that reliably positions the drop jet fluxer, preheat unit and soldering unit during the process. Depending on requirements, the electromagnetic soldering unit may be used for flexible mini-wave soldering processes, or can be equipped with a multi-nozzle tool for dip soldering with short cycle times.
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New LEXAN CXT film from SABIC offers high thermal process stability and transparency for demanding printed electronics substrates.
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Indium8.9HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloys.
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Mouser has released a new eBook in collaboration with Analog Devices, that offers a detailed analysis of the technologies being used to support sustainable manufacturing practices.
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On-the-fly marking at high speeds is only one of the comprehensive features of Panasonic’s new LP-RH laser marker series.
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