DSP, Micros & Memory


Latest Articles

GigaDevice expands GD25UF Series density
30 March 2026, NuVision Electronics
GigaDevice has announced the expanded density range of its GD25UF series 1,2 V ultra-low power SPI NOR Flash, now spanning from 8 Mb to 256 Mb.

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ARINC 429 line driver evaluation board
30 March 2026, ASIC Design Services
Holt Integrated Circuits have announced the release of the ADK-85104 Evaluation Board, a compact, ready-to-use platform designed to help engineers rapidly evaluate and characterise Holt’s HI-85104.

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Highly integrated 24-channel mixed signal IC
30 March 2026, EBV Electrolink
Microchip Technology has announced the LX4580, a 24-channel mixed-signal IC designed to replace multiple discrete components with a single device that supports synchronised data acquisition, fault monitoring, and motor control.

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Lower-power Thread and BLE connectivity
30 March 2026, iCorp Technologies
Espressif has released the ESP32-H21, a low-power wireless SoC aimed at Thread, Matter, Zigbee, and Bluetooth LE device designs.

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Touch-enabled 32-bit MCU
30 March 2026, EBV Electrolink
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.

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Build smarter with UNO Q
30 March 2026, Electrocomp Express
The Arduino UNO Q’s hybrid design combines a Linux Debian-capable microprocessor with a real-time STM32U585 microcontroller making it the perfect dual-brain platform for the next innovation.

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Compact AI modules for imaging
30 March 2026, Otto Wireless Solutions
SIMCom has introduced two compact smart AI modules, the SIM8666 and SIM8668, designed to simplify the development of imaging-based IoT applications.

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Compact Renesas MCU rapid development board
30 March 2026, Dizzy Enterprises
Built around the Renesas R7FA4M2AD3CFP microcontroller, the Clicker 4 board provides engineers with a ready to use solution for prototyping and testing applications that require reliable ARM based processing and flexible expansion.

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IO Ninja and Python working hand-in-hand
30 March 2026, RF Design
IO Ninja is a professional all-in-one terminal emulator, sniffer, and protocol analyser that runs natively on Windows, Linux, and macOS, and excels as a UI debugger for serial, network, USB, and all other forms of communication.

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GHz-speed multi-channel digitiser system
30 March 2026, Vepac Electronics
A new Star Hub option from Spectrum Instrumentation enables the creation of scalable multi-channel data acquisition systems with ultrafast sampling speeds of up to 10 GS/s.

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Quad RF ADC/DAC for wideband transceiver design
28 February 2026, Altron Arrow
The AD9084 from Analog Devices integrates a quad 16-bit RF digital-to-analogue converter with a maximum sampling rate of 28 GSPS and a quad 12-bit RF analogue-to-digital converter.

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High-performance FPGA family
28 February 2026, EBV Electrolink
AMD’s Kintex UltraScale+ FPGA family delivers high-performance, mid-range field programmable gate arrays that balance price, performance, and power efficiency for demanding DSP applications.

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Compact and scalable development board
27 November 2025
The FRDM-MCXW72 from NXP is a compact and scalable development board for rapid prototyping of the MCX W72 multiprotocol wireless MCU.

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High-performance processing for cost-aware industrial IoT
27 November 2025, Altron Arrow
STMicroelectronics has expanded its industrial processing portfolio with the new STM32MP2 series, a family of application microprocessors designed to deliver higher performance, advanced security and long-term reliability for cost-sensitive industrial IoT systems.

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Development board for secure industrial and IoT applications
27 November 2025
The FRDM-i.MX93 Development Board from NXP is a compact, entry-level platform built around the powerful i.MX 93 applications processor, designed to accelerate prototyping and development for industrial, IoT, and edge computing applications.

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KIOXIA pioneer new 3D Flash technology
27 November 2025, EBV Electrolink
KIOXIA Corporation and Sandisk Corporation pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.

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Ultra-wide signal capture from a single chip
27 November 2025, RFiber Solutions
Jariet Technologies developed Electra, a chipset that enables ultra-wide, multi-function and multi-band signal capture and generation from a single component.

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High-performance processing at the edge
27 November 2025, Altron Arrow
STMicroelectronics’ STM32MP23 microprocessor is designed to meet the demands of industrial, IoT, and edge AI applications.

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High-speed Flash for system-on-chip applications
27 November 2025, NuVision Electronics
GigaDevice unveiled the GD25NE series of dual-power supply SPI NOR Flash chips, designed specifically for 1,2 V SoC applications.

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Ultra-low-power Arm Cortex MCU with FPU
27 November 2025, Altron Arrow
STMicroelectronics expanded its STM32 ultra-low-power family with the launch of the STM32U3 for cost-sensitive applications in industrial, medical, and consumer electronics devices.

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