DSP, Micros & Memory


Latest Articles

PolarFire SoC FPGAs achieve AEC-Q100 qualification
30 April 2025, ASIC Design Services
Microchip Technology’s PolarFire SoC FPGAs have earned the Automotive Electronics Council AEC-Q100 qualification.

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Integrated STM32WBA6 wireless microcontrollers
30 April 2025, Altron Arrow
Cost-efficient and highly integrated embedded controllers for emerging 2,4 GHz wireless applications in smart home, health, factory, and agriculture.

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Ultra-low-power MCU with FPU Arm Cortex-M33
30 April 2025, Altron Arrow
STMicroelectronics has expanded its STM32 ultra-low-power family with the launch of the STM32U3 for cost-sensitive applications in industrial, medical, and consumer electronics devices.

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Low-jitter oscillators
30 April 2025
The JOH21, JOE21 and JOD21 low-jitter oscillators with differential output are designed for applications that require accurate timing and precise synchronisation.

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Raspberry Pi 5 SBC
30 April 2025, Electrocomp Express
The Raspberry Pi 5 single board computer builds on the phenomenal success of its predecessor, the Raspberry Pi 4, delivering a 2-3x increase in CPU performance.

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The world’s first RISC-V MCU to achieve PSA-L2
30 April 2025, iCorp Technologies
Espressif’s ESP32-C6 is the world’s first RISC-V MCU to achieve PSA-L2 security certification, security certification, underscoring the company’s commitment to delivering robust, secure, and reliable IoT solutions.

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32 Mbit SRAM chip
30 April 2025, Brabek
To meet the demand for high-density fast CMOS SRAM, Alliance Memory has introduced a new 32 Mbit device in the 6 x 8 mm 48-ball FBGA package, which offers a wide power supply range from 1,65 to 3,6 V.

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Connectivity for industrial applications
30 April 2025, iCorp Technologies
Quectel has introduced the SG882G, its latest flagship Android/Linux smart module, designed to deliver exceptional computing power, multimedia capabilities, and seamless connectivity for industrial and consumer applications.

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Eval board for MEMS sensors
30 April 2025, Altron Arrow
ST’s STEVAL-MKI109D is an evaluation platform that allows engineers to monitor the behaviour of ST MEMS sensors and maximise the performance of new product designs, accelerating time to market.

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High reliability memories
28 March 2025, Altron Arrow
Infineon’s mil-temp memories offer a wide selection of volatile and non-volatile memories for applications that meet QML-Q certifications and offer support for mil-aero applications.

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KIOXIA pioneer new 3D Flash technology
28 March 2025, EBV Electrolink
KIOXIA Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.

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Artificial intelligence meets embedded development
28 March 2025, Avnet Silica
Microchip Technology is leveraging the power of artificial intelligence (AI) to assist software developers and embedded engineers in writing and debugging code with the launch of its MPLAB AI Coding Assistant.

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Embedded module for AI vision applications
28 March 2025, Rugged Interconnect Technologies
The TQMa95xxSA supports AI/ML with vision applications through an integrated NPU and an image processor unit.

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High-speed Flash for SoC applications
28 March 2025, NuVision Electronics
GigaDevice has unveiled the GD25NE series of dual-power supply SPI NOR Flash chips, designed specifically for 1,2 V system-on-chip (SoC) applications.

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Super-fast H.264 encoder FPGA core
28 March 2025, EBV Electrolink
An ITAR-compliant H.264 core designed for AMD FPGAs provides baseline H.264 support and is currently the smallest and fastest FPGA core in the industry.

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ST MCUs extend ultra-low power innovation
28 March 2025, Altron Arrow
STMicroelectronics has introduced new STM32U3 microcontrollers with cutting-edge power-saving innovations that ease deployment of smart connected tech, especially in remote locations.

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Chipset enables ultra-wide signal capture
28 March 2025, RFiber Solutions
Jariet Technologies has developed Electra, a chipset that enables ultra-wide, multi-function and multi-band signal capture and generation from a single component.

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SoC for real-time AI at the edge
28 March 2025, Future Electronics
Ambiq’s Apollo330 Plus series is purpose-built to enable always-on and real-time AI inferencing on devices.

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Evaluation kit for ML applications
28 March 2025, Future Electronics
The hardware kit includes radar, acoustic, pressure and motion sensors and integrates dual Arm Cortex-M4 and Cortex-M0+ CPU cores.

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Microprocessors with advanced graphics and connectivity
28 March 2025, Avnet Silica
Microchip’s SAMA7D65 MPU runs a 1 GHz Arm Cortex-A7 core and integrates MIPI DSI, LVDS display interfaces and 2D GPU for HMI applications.

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