Alliance Memory has expanded its product offering with a new line of high-speed CMOS DDR4 SDRAMs. For improved performance over previous-generation DDR3 devices, the 4 GB AS4C256M16D4 and AS4C512M8D4 offer lower power consumption and faster data transfer rates in 96-ball and 78-ball FBGA packages.
Compared to DDR3 SDRAMs, the devices reduce operating voltages from 1,5 V to +1,2 V (±0,06 V) to increase battery life in portable electronics such as notebook computers, smartphones and tablets. For increased efficiency and performance in desktop computers and servers, the 256 MB x 16-bit AS4C256M16D4 and 512 MB x 8-bit AS4C512M8D4 offer up to 16 memory banks and deliver faster clock speeds to 1333 MHz for extremely high transfer rates of 2400 Mbps/pin (1200 MHz) and 2666 Mbps/pin (1333 MHz).
With minimal die shrinks, the DDR4 SDRAMs provide reliable drop-in, pin-for-pin-compatible replacements for numerous similar solutions – eliminating the need for costly redesigns and part requalification. Offered in commercial and industrial temperature ranges, the devices are ideal for the industrial, medical, IoT, automotive, gaming and consumer markets.
1 GHz crossover MCU with Arm Cortex Cores Future Electronics
DSP, Micros & Memory
i.MX RT1170 Crossover MCUs, from NXP Semiconductor, are dual-core devices featuring an Arm Cortex-M7 and Arm Cortex-M4 for real-time microcontroller (MCU) performance and high integration for automotive, industrial and IoT applications.
Read more...NECTO studio update 7.5.0
DSP, Micros & Memory
MIKROE have continued their collaboration with Renesas by introducing support for the RL78 architecture in NECTO Studio, expanding the IDE beyond its existing MCU platforms.
Read more...UFS 5.0 flash for on-device AI EBV Electrolink
DSP, Micros & Memory
UFS 5.0 embedded flash memory solutions, designed to deliver the performance, efficiency and capacity required for the next generation of AI-enabled mobile and edge devices.
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DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
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DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.
Read more...Industrial-grade ESP32-S3 controller
DSP, Micros & Memory
Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.
Read more...Universal NFC device Altron Arrow
DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
Read more...Java Card-based solution Future Electronics
Analogue, Mixed Signal, LSI
The SECORA ID Key S USB, from Infineon Technologies, is a Java Card-based solution with USB and NFC connectivity for secured authentication and digital signatures.
Read more...Compact low-power 32-bit platform EBV Electrolink
DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.
Read more...Bridging the gap between prototype and production
DSP, Micros & Memory
Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.
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