Verotec’s Diplomat metal enclosure range is recognised worldwide as one of the leading products in its field, having evolved around a number of international standards and in response to a number of trends. These cases are strong yet lightweight and provide an inherent level of EMC protection due to their overall metal construction. Available as cases and caseframes, Diplomat provides a tough yet aesthetically pleasing packaging solution which is equally effective in workshop, laboratory or office environments.
Why would you choose to use a Diplomat enclosure? In a word, accuracy. The need to provide a precise framework in which subracks are supported and protected is most efficiently achieved using accurate die casting technology and hard-tooled cover designs. The function of an enclosure now extends far beyond the pure packaging role and covers such areas as RFI protection.
Using tests based on and adapted from, MIL-STD 285, Diplomat is proven to achieve an impressive level of EMC protection as standard. For users requiring a greater measure of EMC protection, Diplomat caseframes can be converted into fully RFI shielded units by means of optional conversion kits.
Diplomat caseframes are designed for the direct mounting of Eurocard circuit boards and modules to IEC 297-3, DIN 41494 Pt. 5 and BS 5954. They are available with EMC conversion kits which give high levels of attenuation. The basic unit, however, will also afford EMC protection due to its metal construction. The cooling performance of this unit has also been improved, especially in the slot 1 region of VME systems, where hot cards are often situated. These units are supported by a range of accessories which increase their versatility and application environment. These units are also rated at IP30.
The Diplomat range of enclosures has improved cooling performance in both the standard and fan plinth versions. The fan plinth version has a wider plinth with an increased ventilation surface area to increase the volume of air flow. The plinth can either act as a chamber for air collection when fans are mounted on the rear panel of the unit (pull-through air flow) or can be used to mount fans directly, hence employing a push method of cooling. Fans can be mounted in the plinth and on the rear panel employing a push-pull method of cooling. Ducting plates can be placed in the plinth to give additional direction to the air flow, concentrating the flow towards hot cards or components.
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