Nordic Semiconductor announced that Tangshan, China-based Tangshan Hongjia Electronic Technology has selected Nordic’s nRF52840 Bluetooth 5.2/Bluetooth Low Energy (Bluetooth LE) advanced multiprotocol System-on-Chip (SoC) to provide the wireless connectivity for its ‘HJ-840’ ultra-compact System-in-Package (SiP) module.
Weighing only 0,3 g, the HJ-840 SiP module comes in a 6,2 by 7 by 0,9 mm package size and is designed for OEMs developing highly space-constrained applications, for example advanced wearables, miniaturised sensors, and medical devices. The SiP module features a built-in long-distance, high-performance antenna, as well as support for an external antenna if required. According to the company, the antenna and the Nordic SoC’s support for Bluetooth Long Range enable the module to achieve a range of between 50 and 80 metres in open areas (Tx power 0 dbm, 1 Mbps throughput).
The module is powered by the nRF52840 SoC’s 64 MHz, 32-bit Arm Cortex M4 processor with floating point unit (FPU), a 2,4 GHz multiprotocol radio (supporting Bluetooth 5.2, ANT, Thread, Zigbee, IEEE 802.15.4, and proprietary 2,4 GHz RF protocol software) featuring 95 dBm Rx sensitivity and a total link budget of 103 dBm, as well as a generous 1 MB Flash and 256 KB RAM memory allocation. It can support even the most complex and computationally intensive applications. The module is qualified for operation across a -40°C to 105°C temperature range.
Nordic’s nRF52840 SoC supports all the features of Bluetooth 5.2 (including four times the range or two times the raw data bandwidth (2 Mbps)) compared with Bluetooth 4.2. Designed to address the inherent security challenges that are faced in IoT, the nRF52840 SoC incorporates the Arm CryptoCell-310 cryptographic accelerator, offering best-in-class security. The SoC is supplied with Nordic’s S140 SoftDevice, a Bluetooth 5-certified software protocol stack for building long-range and high data throughput Bluetooth LE applications.
“The nRF52840 is one of the Bluetooth LE SoCs with the most complete functionality, best performance and lowest power consumption to date,” says Liu Jiahang, CTO, Tangshan Hongjia. “We can’t find any competitor’s product on the market to match it, and just as importantly the price of such a high performance SoC is still very economical.
“Nordic’s software development kit (SDK) is designed specifically for software engineers. Any software engineer who does not understand hardware can quickly get to grips with the Nordic SDK. If a problem is encountered, Nordic provides one-to-one support which should increase the confidence of developers.”
Strategic agreement for eSIM solutions Avnet Silica
Telecoms, Datacoms, Wireless, IoT
This agreement between Avent Silica and Thales covers the latter’s eSIM solutions that are compliant with GSMA SGP.22 and SGP.32 standards.
Read more...High precision multi-GNSS antenna RS South Africa
Telecoms, Datacoms, Wireless, IoT
The Amphenol PCTEL GNSS-L125-DH-NF multi-GNSS antenna is a high-performance antenna designed for reliable global navigation satellite system reception in demanding environments.
Read more...Designing IoT devices for deterministic LPWAN environments
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Built on Ultra Narrow Band communication technology, the Sigfox network focuses on low power, wide area M2M connectivity rather than maximising data throughput.
Read more...Robust LoRaWAN for distributed IoT CST Electronics
Telecoms, Datacoms, Wireless, IoT
InHand Networks has unveiled its latest LoRaWAN gateway, the EC312, marking an evolution in industrial-grade connectivity solutions for distributed IoT environments.
Read more...Miniaturised tuneable harmonic filter bank RFiber Solutions
Telecoms, Datacoms, Wireless, IoT
Modern RF and microwave communication systems require compact, high power filtering solutions to suppress unwanted harmonic signals generated by power amplifiers, and to address this challenge, Tri-TeQ has developed a miniaturised broadband tuneable harmonic switched filter bank.
Read more...Nordic accelerates cellular IoT leadership RF Design
Telecoms, Datacoms, Wireless, IoT
The company unveiled its next-generation portfolio featuring Cat 1 bis, satellite NTN, and advanced LTE-M/NB-IoT with edge AI, delivering secure and resilient connectivity across billions of IoT devices.
Read more...Powering the future of industrial automation IOT Electronics
Telecoms, Datacoms, Wireless, IoT
5G, the 5th generation of wireless broadband technology, enables users to establish reliable connectivity, which in turn enables flexible, autonomous, and efficient processes from production to logistics.
Read more...Wi-Fi 7 tri-band connectivity module iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel has introduced the FCE870Q, a compact short range wireless connectivity module designed for next generation IoT devices that require high throughput, low latency, and reliable operation in dense wireless environments.
Read more...Compact cellular IoT SiP with GNSS RF Design
Telecoms, Datacoms, Wireless, IoT
Combining low-power connectivity, edge processing, and positioning capabilities in a compact module, Nordic’s nRF9151 targets applications such as asset tracking, smart metering, industrial monitoring, and smart city infrastructure.
Read more...Enabling the next generation of high-performance wireless designs iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Espressif Systems has expanded its wireless connectivity portfolio with the introduction of the ESP32-E22, a high-performance connectivity co-processor designed for next generation embedded and IoT systems.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.