Lattice Semiconductor announced the first FPGA developed on its new Lattice Nexus FPGA platform, the CrossLink-NX. This new FPGA provides the low power, small form factor, reliability, and performance that developers need to create innovative embedded vision and AI solutions for communications, compute, industrial, automotive, and consumer systems.
FPGAs are a compelling hardware platform for embedded vision and AI applications, as they perform functions in parallel. This parallel architecture significantly accelerates certain processing workloads, including data inferencing.
Key features of the CrossLink-NX include:
• Low power – built on the Lattice Nexus FPGA platform, CrossLink-NX provides up to a 75% reduction in power consumption compared to competing FPGAs of a similar class.
• High reliability – CrossLink-NX has a soft error rate (SER) up to 100 times lower than similar FPGAs in its class, making it a compelling solution for mission-critical applications that must operate safely and reliably. The initial CrossLink-NX device is designed to support ruggedised environments found in outdoor, industrial, and automotive applications.
• Enhanced performance enabled by fast I/O support, instant-on performance and high memory to logic ratio with 170 bits of memory for every logic cell.
• Small form factor – to support customer system miniaturisation, the first CrossLink-NX device is available in a 6 x 6 mm form factor which is up to ten times smaller than similar competing FPGAs in its class.
• Software tools and IP – in addition to its new Lattice Radiant 2.0 design software, Lattice offers a robust library of popular IP cores including interfaces like MIPI D-PHY, PCIe, SGMII and OpenLDI, and demos for common embedded vision applications such as 4:1 image sensor aggregation.
Qualcomm AI stack: a unified AI software solution Future Electronics
Computer/Embedded Technology
Qualcomm has bundled all its AI software offerings into a single package called the Qualcomm AI Stack which will assist developers in deploying AI applications.
Read more...New compact SMT chokes for low-voltage applications Future Electronics
Passive Components
TDK has released three new B8272 series of compact EPCOS SMT common-mode chokes specially developed for DC/DC converters and low-voltage applications.
Read more...Green laser diode for industrial applications Future Electronics
Opto-Electronics
ams OSRAM has introduced a green laser diode which is a brighter, more reliable and cost-competitive replacement for red lasers in applications such as levelling, scanning, biosciences and dot projection. ...
Read more...Green laser diode for industrial applications Future Electronics
Opto-Electronics
ams OSRAM has introduced a green laser diode which is a brighter, more reliable and cost-competitive replacement for red lasers in applications such as levelling, scanning, biosciences and dot projection. ...
Read more...Small wire-to-board connector with automotive quality Future Electronics
Interconnection
Hirose Electric has developed the GT50 Series, a 1 mm pitch, small and robust wire-to-board connector. This product can be used safely for automotive applications due to its high heat resistance up to ...
Read more...MCU boasts innovative sensing, enhanced security Future Electronics
DSP, Micros & Memory
Enabled with Bluetooth Low Energy wireless connectivity, onsemi’s new low-power RSL15 microcontroller (MCU) addresses the growing demand of connected industrial applications for security without sacrificing ...
printer friendly version