Ambiq has unveiled the Apollo330 Plus System-on-Chip (SoC) series. This series consists of the base Apollo330 Plus, the Apollo330B Plus, and the Apollo330M Plus, each offering a rich set of peripherals and connectivity options for healthcare, smart homes and buildings, industrial edge applications, and more to drive always-on and real-time AI at the edge.
The Apollo330 Plus series is purpose-built to enable always-on and real-time AI inferencing on devices. Built on Ambiq’s proprietary subthreshold power optimised technology (SPOT) platform, it achieves unprecedented 16x faster performance and up to 30x better AI energy efficiency compared to similar solutions based on previous generation Cortex-M processors. This allows manufacturers to be able to deliver innovative features, while extending device lifetimes, offering multi-protocol connectivity across diverse endpoints, and enhancing user experiences.
The Apollo330 Plus architecture fully leverages the Arm Cortex-M55 processor with Arm Helium technology for AI acceleration, processing up to 8 MACs per cycle. The Apollo330 Plus series includes 2 MB of on-chip system RAM, 2 MB of embedded non-volatile memory, a large 32 kB I-cache and 32 kB D-cache on a wide bus, and a multi-protocol radio for developers to create high-performing and power-efficient products.
High performance SDR design considerations RFiber Solutions
Editor's Choice DSP, Micros & Memory
As the spectrum gets increasingly crowded, and adversaries more capable, the task of examining wide bands and making sense of it all, while not missing anything, gets harder.
Read more...Direct RF converters and FPGAs boost EW applications RFiber Solutions
DSP, Micros & Memory
The latest boost to electronic warfare designs comes from emerging FPGA architectures that combine advanced RF converters and high-performance processing engines in a single package.
Read more...1-Wire EEPROM with secure authenticator Altron Arrow
DSP, Micros & Memory
The DS28E54 secure authenticator combines FIPS 202-compliant secure hash algorithm (SHA-3) challenge and response authentication with secured electrically erasable programmable read-only memory.
Read more...New SiC power MOSFET Future Electronics
Power Electronics / Power Management
STMicroelectronics’ SCT012H90G3AG is a robust, automotive-grade SiC MOSFET, engineered for demanding power electronics, featuring a 900?V drain-source voltage and exceptionally low on-resistance of 12?mO at 60?A.
Read more...Satellite IoT through non-terrestrial networks Future Electronics
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Non-terrestrial networks fill cellular coverage gaps in remote areas by extending terrestrial networks and are not subject to disruptions from natural disasters or sabotage.
Read more...1D Time-of-Flight sensor Future Electronics
Telecoms, Datacoms, Wireless, IoT
ams OSRAM has introduced its TMF8806, a 1D Time-of-Flight sensor that has been developed to remove the barriers of previous single-zone dToF devices.
Read more...Easy installation panel mount assembly Future Electronics
Enclosures, Racks, Cabinets & Panel Products
NKK’s new easy installation Panel Mount Assembly (the BYB201-470) consists of a PCB, resistor, connector, and a straight PC adaptor.
Read more...MCX C Series development board Avnet Silica
DSP, Micros & Memory
The FRDM-MCXC444 is a compact and scalable development board for rapid prototyping of MCX C444 MCU from NXP Semiconductors.
Read more...Redefining entry-level MCUs NuVision Electronics
DSP, Micros & Memory
The company positions the GD32C231 series as a ‘high-performance entry-level’ solution designed to offer more competitive options for multiple applications.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.