Avnet Silica has signed a distribution agreement with Insight SiP, a leading developer of ultra-miniature RF modules with embedded antennas, using system-in-package and antenna-in-package technology.
Avnet Silica customers across the EMEA region are now able to purchase a range of Insight SiP (System-in-Package) modules, including:
• Bluetooth Low Energy (BLE) modules for short-range networking, including the iSP19, iSP18 and iSP15 series. These devices are designed to provide low-cost, low-power wireless connectivity in PCs, smartphones, IoT smart objects and M2M across diverse sectors such as domotics/home automation, healthcare, industrial and wearables.
• Low Power Wide Area Network (LPWAN) iSP45 series, which incorporates long-range LoRa connectivity with short-range BLE 5.0 and NFC for setup and maintenance.
All of the Insight SiP modules offered by Avnet Silica feature integrated antennas and are fully certified by the Bluetooth SIG (Special Interest Group) and by global regulatory bodies such as the FCC, CE and TELEC.
The increased demand for wireless connectivity in portable electronic devices has driven manufacturers to deliver smaller, more cost-effective solutions. This makes the integration of RF into a single product more and more complex and increases technical risk, while at the same time design engineers are under increasing pressure to shorten the product development cycle. SiP technology enables greater functionality to be achieved in less time than is associated with designing and certifying products based on discrete devices. SiP design also avoids incurring the time-to-market penalty and higher upfront cost of ASIC development.
The trends driving uptake of IoT Platform as a Service Trinity IoT
Editor's Choice Telecoms, Datacoms, Wireless, IoT
IoT platforms, delivered as a service, are the key that will enable enterprises to leverage a number of growing trends within the IT space, and access a range of benefits that will help them grow their businesses.
Read more...Microprocessor with integrated NPU Avnet Silica
DSP, Micros & Memory
The RZ/G3E from Renesas is a microprocessor integrated with quad CPU and NPU in one chip, improving power efficiency, reliability, and security.
Read more...RF power amplifier RF Design
Telecoms, Datacoms, Wireless, IoT
The ZHL-20M2G7025X+ from Mini-Circuits is a 32 W power amplifier that operates from 20 to 2700 MHz and delivers a saturated output power of +45 dBm.
Read more...Introducing the Quectel EG800Z series iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
The EG800Z series is Quectel’s latest ultra-compact LTE Cat 1 bis module, designed to deliver reliable connectivity, low power consumption, and robust performance across a wide range of IoT applications.
Read more...NeoMesh on LoRa CST Electronics
Telecoms, Datacoms, Wireless, IoT
Thomas Steen Halkier, CEO of NeoCortec, recently gave a keynote speech where he spoke about “NeoMesh on LoRa: Bringing true mesh networking to the LoRa PHY”.
Read more...Modules upgraded with Direct-to-Cell tech iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has announced that several of its LTE modules are now available with Direct-to-Cell (D2C) functionality, enabling devices to seamlessly connect to satellite networks.
Read more...USB/Ethernet smart RF power sensor RF Design
Telecoms, Datacoms, Wireless, IoT
The PWR-18PWHS-RC from Mini-Circuits is an RF power sensor that operates from 50 MHz to 18 GHz and is designed to capture pulsed and trace modulated signals with very high data resolution.
Read more...Tiny Bluetooth LE + 802.15 + NFC module RF Design
Telecoms, Datacoms, Wireless, IoT
Unleashing enhanced processing power, expanded memory, and innovative peripherals, the BL54L15µ from Ezurio is the ultimate choice for small and low power connectivity.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version