DSP, Micros & Memory


MCU evaluation and development kits

25 August 2021 DSP, Micros & Memory

RS Components announced availability of a new range of evaluation and development kits for Infineon Technologies’ AURIX family of microcontrollers (MC), which are based on the manufacturer’s 32-bit TriCore microprocessor core.

Infineon’s AURIX TriCore concept combines the elements of a RISC processor core, a microcontroller and a DSP in a single microcontroller chip that combines embedded safety and security features, making it an attractive choice for electronics designers developing systems for a wide range of automotive and industrial applications.

The series of Arduino-compatible, low-cost evaluation and development kits ranges from simple design projects up to more sophisticated designs. In addition, and to simplify development, Infineon’s AURIX platform offers a highly integrated software development environment (IDE) providing engineers with everything they need to compile, debug and flash-program their AURIX MCU-based applications.

The AURIX TC297 TFT application kit, for example, offers a low-cost and flexible application development platform for the 32-bit AURIX TriCore platform. The kit comes with various on-board components with specific features including the TC297 controller in a 292-pin LFBGA package, a 320x240 LCD display, SD card slot, high-speed CAN transceiver and acoustic beeper.

At the high end of the AURIX portfolio, the range offers fully featured kits tailored to automotive and industrial use cases such as motor control units or automotive gateways. At the lower end, the range includes the TC275 ‘lite’ and the TC375 ‘lite’ kits, both supported by the free-of-charge IDE (AURIX Development Studio). In addition, the TC275 ‘shield buddy’ and the TC375 ‘lite’ low-cost kits follow the Arduino standard, making them compatible with many of the widely available application shields.

The portfolio provides an extensive range of options for engineers, including a wide choice of memories, peripheral sets, frequencies, temperatures and packaging options.


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