Power Electronics / Power Management


Baseless power modules qualified for aerospace use

25 August 2021 Power Electronics / Power Management

In the race to reduce aircraft emissions, developers are increasingly moving toward more efficient designs, including electrical systems that replace today’s pneumatics and hydraulics powering everything from on-board alternators to actuators and auxiliary power units (APUs). To enable next-generation aircraft electrical systems, new power conversion technology is required.

Microchip Technology accordingly announced its development with Clean Sky, a joint European Commission (EC) and industry consortium, of the first aerospace-qualified baseless power modules enabling higher-efficiency, lighter and more compact power conversion and motor drive systems.

Partnering with Clean Sky to support aerospace industry goals set by the EC for stricter emission standards to achieve climate neutral aviation by 2050, Microchip’s BL1, BL2 and BL3 family of baseless power modules provides greater efficiency in AC-to-DC and DC-to-AC power conversion and generation through the integration of its silicon carbide (SiC) power semiconductor technology. 40% lighter than others due to the modified substrate, the innovative design also produces an approximate 10% cost saving over standard power modules that incorporate metal baseplates.

BL1, BL2 and BL3 devices meet all mechanical and environmental compliance guidelines set forth in RTCA DO-160G, ‘Environmental Conditions and Test Procedures for Airborne Equipment,’ Version G (August 2010). RTCA is the industry consortium that develops consensus on critical aviation modernisation issues.

The modules are available in low-profile, low-inductance packaging with power and signal connectors that designers can solder directly on printed circuit boards, helping to speed development and increase reliability. The same height across the modules in the family enables them to be paralleled or connected in a three-phase bridge and other topologies to achieve higher-performing power converters and inverters.

The family incorporates silicon carbide MOSFETs and Schottky barrier diodes (SBDs) to maximise system efficiency. In packages delivering 100 W to more than 10 kW of power, the BL1/2/3 family is available in numerous topology options including phase leg, full bridge, asymmetric bridge, boost, buck and dual common source. These high-reliability power modules are available in voltage ranges from 600 V to 1200 V in silicon carbide MOSFETs and IGBTs to 1600 V for rectifier diodes.

The power modules are available as 75 A and 145 A silicon carbide MOSFET, 50 A as IGBT and 90 A as rectifier diode outputs.

For more information contact EBV Electrolink, +27 21 402 1940, capetown@ebv.com, www.ebv.com


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