ams Osram has expanded its 3D sensing portfolio with four new VCSEL modules. The number of applications which utilise 3D sensing technology continues to increase, from the detection of the surroundings for robots to avoid collisions to the unlocking of smartphones via facial recognition. But 3D sensing also plays an important role for augmented and virtual reality (AR/VR) glasses.
Thanks to components like Bidos P2433 Q, various gestures can be reliably captured, raising the interaction between user and AR/VR glasses to a new level. The compact package also allows customers particular design flexibility. For augmented and virtual reality devices, as well as other 3D world-facing applications, the focus is on maximum user experience combined with compact and lightweight design. In the 3D sensing market, vertical cavity surface emitting lasers (VCSEL) have a huge impact due to their good beam quality, cost efficiency and simple design.
Bidos P2433 Q is available in four different versions including two different fields-of-illumination and two output power levels. The VCSEL-based modules with a size of 3,3 mm x 2,4 mm are suitable for 3D sensing applications using time-of-flight (ToF) measurement, which require a homogeneous illumination of the scene. Due to their wavelength of 940 nm, all modules are also free from the red glow effect which is perceived by the human eye as disturbing flickering.
The two higher-power modules with 6,5 W use dual-junction VCSELs for enhanced performance and efficiency of up to 45%. In addition, a photodiode monitoring system is integrated into the module as a special protection mechanism for eye safety. If the photodiode registers a change in the incidence of light – for example, if the optics are damaged – the current supply to the VCSEL is interrupted.
Besides 3D gesture recognition, the four new modules can also be used in industrial robotics for obstacle avoidance and virtual fencing, or in 3D face authentication systems in smart door locks or point-of-sale payment terminals.
Qualcomm AI stack: a unified AI software solution Future Electronics
Computer/Embedded Technology
Qualcomm has bundled all its AI software offerings into a single package called the Qualcomm AI Stack which will assist developers in deploying AI applications.
Read more...Hamamatsu Photonics boosts production capacity Hamamatsu Photonics UK
Opto-Electronics
Hamamatsu Photonics increases its current production capacity almost two-fold to help with expanding sales after completion of a new factory complex.
Read more...New compact SMT chokes for low-voltage applications Future Electronics
Passive Components
TDK has released three new B8272 series of compact EPCOS SMT common-mode chokes specially developed for DC/DC converters and low-voltage applications.
Read more...Digital ambient light sensor EBV Electrolink
Opto-Electronics
The device is a highly sensitive light-to-digital converter that transforms light intensity into a digital signal output through an I2C digital interface.
Read more...Compact planar scanner with air bearing Horne Technologies
Opto-Electronics
PIglide positioning systems are ideally suited for high-precision applications such as inspection systems, laser marking, microscopy or scanning.
Read more...Green laser diode for industrial applications Future Electronics
Opto-Electronics
ams OSRAM has introduced a green laser diode which is a brighter, more reliable and cost-competitive replacement for red lasers in applications such as levelling, scanning, biosciences and dot projection. ...
printer friendly version