The new super-junction STPOWER MDmesh K6 series from STMicroelectronics enhances several key parameters to minimise system-power losses. It is especially suited to lighting applications based on flyback topology, such as LED drivers, HID lamps, adaptors and power supplies for flat-panel displays.
ST claims that the MDmesh K6 has the best RDS(on) x area at 800 V currently available in the market, enabling compact new designs that combine high power density with high efficiency. In addition, the K6 series has a reduced threshold voltage compared with the previous MDmesh K5 generation, enabling a lower driving voltage and thus reducing power losses and gaining efficiency mainly for zero-Watt standby applications. The total gate charge (Qg) is also very low, permitting high switching speeds and low losses. An integrated ESD protection diode increases the overall ruggedness of the MOSFET up to Human Body Model (HBM) Class 2.
Low profile SMD antenna Altron Arrow
Telecoms, Datacoms, Wireless, IoT
The Havok PCS.06.A antenna, from Taoglas, is a low profile SMD LTE/cellular 4G/3G/2G embedded antenna designed for direct SMD mount on a device PCB.
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SemiQ’s half-bridge series for data centre power converters and industrial motor drives features low RDSON SiC MOSFETs and parallel SBD diodes for best-in-class power density and conversion efficiency.
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With billions of rechargeable and non-rechargeable lithium cells and batteries powering most of the world’s consumer and industrial electronic devices, shipping them to customers through vast global logistics chains is often an overlooked topic.
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With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
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The new ITECH IT8900G/L high-speed, high-power DC electronic load offers a powerful combination of speed, scalability, precision and high-power density.
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Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
Read more...Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
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The NXP i.MX 937 applications processor is optimised for performance without excessive power draw and bridges the gap between entry-level chips and high-end processors.
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Opto-Electronics Electronics Technology AI & ML
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
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