HopeRF’s RFM6501W module is a system-on-chip (SoC) module embedded with a Cypress 32-bit Cortex-M0+ low-power microcontroller and the SX1262 LoRa chip from Semtech. It has ultra-low power consumption, high sensitivity, long-distance communication and high performance.
The device integrates a wealth of peripherals, providing for multiple general-purpose I/Os, 32,768 kHz external crystal oscillator, channel interception, high-precision RSSI and 12-bit high-speed ADC input. Resistance to interference makes it well suited for complex environments.
It has a receiving sensitivity of -137 dBm, working frequency of 470 MHz, 868 MHz and 915 MHz, supply voltage range of 2,4-3,7 V, transmit current of 107 mA (at +22 dbm, 470 MHz) and receiver current of 9 mA (at 470 MHz).
Quectel’s single-board computers put industrial edge computing on one PCB iCorp Technologies
Computer/Embedded Technology
Quectel Pi series of single-board computers (SBCs), designed for a broad range of industrial applications, include three compact development platforms – the Quectel Pi M1, L1, and H1 boards.
Read more...Simplifying system design iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
The FGMC63N tri-band MCU Wi-Fi 6E module from Quectel addresses offers integrated connectivity across 2,4 GHz, 5 GHz, and 6 GHz bands in a compact, highly optimised design.
Read more...Dragino’s connectivity catalogue Otto Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
Where Wi-Fi demands frequent charging and covers tens of meters, and traditional cellular consumes too much power for battery-operated nodes, LoRaWAN threads the needle.
Read more...RF filters explained RFiber Solutions
Telecoms, Datacoms, Wireless, IoT
As RF environments become increasingly crowded, RF filters play a critical role in maintaining signal quality, improving system performance, and ensuring reliable operation.
Read more...Practical design strategies for 5G RF Design
Telecoms, Datacoms, Wireless, IoT
The Cavli CQM211 aims to provide a platform that combines strong 5G connectivity with onboard compute capability, as well as interface flexibility that suits both new designs and rapid migrations from earlier products.
Read more...Low-power memory born for edge AI iCorp Technologies
DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.
Read more...An industry-first Android 16 smart module solution RF Design
Computer/Embedded Technology Telecoms, Datacoms, Wireless, IoT
The MeiG Smart SLM580 4G Smart Module features native support for Android 16 and covers core frequency bands in major countries and regions worldwide.
Read more...Compact MCU for IoT endpoints iCorp Technologies
DSP, Micros & Memory
Quectel’s FCM266D combines single-band 2,4 GHz Wi-Fi 6 with Bluetooth LE 5.4 in an ultra-compact LCC package measuring just 20 x 18 x 2,4 mm.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.