IoT applications increasingly demand higher throughput, lower latency, and flexible spectrum usage. The FGMC63N tri-band MCU Wi-Fi 6E module addresses these needs, offering integrated connectivity across 2,4 GHz, 5 GHz, and 6 GHz bands in a compact, highly optimised design.
Expanding into the 6 GHz spectrum, Wi-Fi 6E reduces congestion, improves throughput, and enables lower-latency connections – essential for dense IoT environments. The FGMC63N supports dynamic tri-band operation, using 2,4 GHz for extended coverage, 5 GHz for balanced performance, and 6 GHz for high-speed, low-interference applications. This makes it ideal for smart homes, industrial automation, medical devices, and advanced consumer electronics.
A key differentiator is the integrated high-performance MCU, which simplifies system design by reducing external components, lowering BOM costs, and accelerating development cycles. Optimised for power efficiency, the module ensures sustained wireless performance in battery-powered and energy-sensitive devices.
Supporting advanced Bluetooth alongside Wi-Fi 6E, the FGMC63N enables seamless hybrid connectivity across complex IoT ecosystems.
Wireless connectivity expanded iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Espressif Systems has introduced two new members of its ESP32 wireless SoC family: the ESP32-E22, the company’s first Wi-Fi 6E connectivity chip, and the ESP32-H21, an ultra-low-power Bluetooth LE microcontroller aimed at coin-cell and battery-powered devices.
Read more...Integrated X-band radar front-end module RF Design
Telecoms, Datacoms, Wireless, IoT
Qorvo has introduced an X-band radar front-end solution that enables defence system designers to achieve higher performance without increasing size, weight or prime power.
Read more...Introducing Aurata CST Electronics
Telecoms, Datacoms, Wireless, IoT
Antenova has launched Aurata SR4L112: a compact, high efficiency embedded 4G/LTE antenna engineered for long, narrow PCB designs.
Read more...Multi-constellation GNSS module in a legacy-compatible footprint Altron Arrow
Telecoms, Datacoms, Wireless, IoT
Telit Cinterion has announced the SE869eK2L, a single-frequency L1 GNSS module designed to help device manufacturers upgrade legacy positioning designs with improved performance and cost efficiency, while preserving design continuity.
Read more...Quectel expands 5G portfolio iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel expands 5G portfolio with new Qualcomm- and UNISOC-based modules.
Read more...Compact RTK design: More than just the receiver iCorp Technologies
Editor's Choice Telecoms, Datacoms, Wireless, IoT
In practice, engineers building compact RTK products keep discovering the same thing: the hardest component in the system is no longer the receiver. It is the antenna.
Read more...Microchip advances Space-Grade timing performance ASIC Design Services
Telecoms, Datacoms, Wireless, IoT
Microchip Technology has expanded its atomic clock portfolio with the radiation-tolerant Space CSAC-SA65, a Chip Scale Atomic Clock designed to deliver precise timing for space systems.
Read more...Channel emulator for 6 G and Wi-Fi 7/8 Concilium Technologies
Telecoms, Datacoms, Wireless, IoT
With 400 MHz instantaneous bandwidth and support for carrier frequencies up to 23,6 GHz, Vertex 6.0 is the industry’s first channel emulator designed for next generation 6 G and Wi-Fi 7/8 testing.
Read more...Secure, low-power Bluetooth LE SoC NuVision Electronics
Telecoms, Datacoms, Wireless, IoT
Silicon Labs unveils BG2B, its lowest-power Bluetooth LE SoC with industry-leading power efficiency, security, and integration.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.