DSP, Micros & Memory

Crossover MCU with 3D camera

24 November 2021 DSP, Micros & Memory

NXP Semiconductors has announced the expansion of its NXP EdgeReady solution portfolio, adding a solution for secure face recognition that leverages a high-performance 3D structured light module (SLM) camera combined with the i.MX RT117F crossover MCU.

This is the first solution to combine a 3D SLM camera with an MCU to deliver the performance and security of 3D face recognition at the edge, thereby removing the need to use an expensive and power-hungry Linux implementation on an MPU, as is traditionally required with high-performance 3D cameras.

The newest EdgeReady solution enables developers of smart locks and other access control systems to add machine learning-based secure face recognition quickly and easily to smart home and smart building products. The solution delivers reliable 3D face recognition in indoor and outdoor applications, across varied lighting conditions including bright sunlight, dim night light, or other difficult lighting conditions that are challenging for traditional face recognition systems.

The use of a 3D SLM camera enables advanced liveness detection, helping to distinguish a real person from spoofing techniques such as a photograph, imitator mask or a 3D model, to prevent unauthorised access.

The i.MX RT117F utilises an advanced machine learning model as part of NXP’s eIQ machine learning software running on its high-performance CPU core that enables faster and accurate face recognition to improve both the user experience and power efficiency.

Similar to the i.MX RT106F MCU-based NXP EdgeReady solution for secure face recognition, advanced liveness detection and face recognition are all done locally at the edge, making it possible for personal biometric data to remain on the device. This helps address consumer privacy concerns while also eliminating the latency associated with cloud-based solutions.

Part of the i.MX RT1170 family of crossover MCUs, the i.MX RT117F is based on an Arm Cortex-M7 CPU with 2 MB of on-chip SRAM and running at up to 1 GHz. The i.MX RT117F includes a licence to use the NXP 3D face recognition software development kit (SDK) and is available in consumer, industrial and automotive temperature grades.


Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

General-purpose evaluation board
Altron Arrow DSP, Micros & Memory
Based on the 32-bit Arm Cortex-M7 S32K3 MCU in a 172 HDQFP package, the S32K3X4EVB-T172 offers dual cores configured in lockstep mode, ASIL D safety hardware, and HSE security engine.

Webinar: Game-changing Matter standard
EBV Electrolink Telecoms, Datacoms, Wireless, IoT
Join Infineon for an exclusive one-hour webinar with EBV Elektronik, exploring the groundbreaking Matter standard, and its profound implications for the future of smart homes.

Unlock power efficiency with the new generation of ultra-low-power MCUs
DSP, Micros & Memory
STMicroelectronics has announced a one-hour webinar on its STM32U0, the company’s latest generation of entry-level, ultra-low-power MCUs.

Using AMD HLS to supercharge your design performance
DSP, Micros & Memory
This workshop explores the power and capabilities of High-Level Synthesis (AMD Vitis HLS) to dramatically accelerate embedded software to hardware speeds.

The 8-bit survival syndrome – Part 2
DSP, Micros & Memory
Just like the 4-bit pre-microcontroller, the 8-bit MCU has been finding ways to stick around. Their features and speeds have been improving, offering competitive reasons to work with them.

Enhanced code protection for USB µC portfolio
Future Electronics DSP, Micros & Memory
To help easily incorporate USB power and communication functionality into embedded systems, Microchip Technology has launched the AVR DU family of microcontrollers.

General-purpose MCU with RISC-V architecture
EBV Electrolink DSP, Micros & Memory
Renesas has released a general-purpose MCU to enhance its existing RISC-V portfolio, and this is its first MCU using a RISC-V core developed internally at the company.

8-bit MCU with I3C support
Avnet Silica DSP, Micros & Memory
The PIC18-Q20 8-bit microcontrollers from Microchip easily interface with devices operating in multiple voltage domains, and the built-in I3C interface supports higher-speed and lower-power data transfers than I2C.

An evolutionary step in customisable logic
Altron Arrow DSP, Micros & Memory
Microchip Technology is offering a tailored hardware solution with the launch of its PIC16F13145 family of microcontrollers, which are outfitted with a new Configurable Logic Block module.

AI-native IoT platform launched
EBV Electrolink AI & ML
These highly-integrated Linux and Android SoCs from Synaptics are optimised for consumer, enterprise, and industrial applications and deliver an ‘out-of-the-box’ edge AI experience.