Computer/Embedded Technology


TPM with PQC-protected firmware update

28 February 2022 Computer/Embedded Technology

The OPTIGA TPM SLB 9672 is the first device in a new generation of future-proof Infineon Technologies trusted platform modules (TPM). This standardised and certified security solution serves as a robust foundation to identify and authenticate PCs, servers and connected devices and to protect data integrity and confidentiality.

Feature-rich and ready for current and future security challenges, the chip comes with extended memory and strong cryptographic algorithms and is the first TPM in the market that offers a PQC-protected firmware update mechanism using XMSS signatures. Integrated resiliency features allow the TPM firmware to be recovered in compliance with the NIST SP 800-193 platform firmware resiliency guidelines.

The OPTIGA TPM SLB 9672 is available in two versions:

•FW15.xx: this standardised and certified security solution is the primary choice for MSFT Windows environment/ecosystem and connected devices with PC architecture.

•FW16.xx: compared with the FW15.xx version, the FW16.xx offers enhanced security features including AES bulk encryption, configuration of the TPM’s unique ID and configuration of the endorsement primary seed.


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Bringing Bluetooth Channel Sounding to automotive and beyond with KW47
Altron Arrow Telecoms, Datacoms, Wireless, IoT
NXP’s new Channel Sounding-certified KW47 and MCX W72 wireless MCUs are set to help automakers with distance measurement, bringing an additional ranging solution for car access and autonomous systems, and will be utilised across a broader spectrum of applications.

Read more...
Wi-Fi 6 and Bluetooth LE coprocessor module
Altron Arrow Telecoms, Datacoms, Wireless, IoT
The ST67W611M1 from STMicroelectronics boasts an all-in-one design which, together with its capabilities, contribute to making it an attractive choice for IoT edge devices requiring a single-chip solution.

Read more...
Wi-Fi 6 plus Bluetooth LE SoC
Altron Arrow Telecoms, Datacoms, Wireless, IoT
Silicon Labs’ SiWx917M SoC is the company’s lowest power Wi-Fi 6 SoC, ideal for ultra-low power IoT wireless devices using Wi-Fi, Bluetooth, Matter, and IP networking for secure cloud connectivity.

Read more...
Simple battery charger ICs for any chemistry
Altron Arrow Editor's Choice Power Electronics / Power Management
The LTC4162 is a highly integrated, high voltage multi-chemistry synchronous monolithic step-down battery charger and PowerPath manager with onboard telemetry functions and optional maximum power point tracking.

Read more...
Microchip enhances TrustMANAGER platform
Altron Arrow DSP, Micros & Memory
Firmware over-the-air updates and remote cryptographic key management provide scalable solutions for addressing IoT security challenges.

Read more...
Adaptive optics’ power solution
Altron Arrow Opto-Electronics
Vicor power-dense adaptive optical modules enable colossal telescopes to look into the past for deep space discoveries.

Read more...
First NVMe SSD Built with 8th-gen BiCS FLASH
EBV Electrolink Computer/Embedded Technology
KIOXIA recently announced the development and prototype demonstration of its new KIOXIA CM9 Series PCIe 5.0 NVMe SSDs, which incorporates CMOS directly Bonded to Array technology.

Read more...
Wide input voltage buck-boost converter
Altron Arrow Power Electronics / Power Management
The MAX77859 from Analog Devices is a high-efficiency, high-performance buck-boost converter targeted for systems requiring a wide input voltage range of between 2,5 and 22 V.

Read more...
High-density power module for AI at the edge applications
Altron Arrow Power Electronics / Power Management
The MCPF1412 power module from Microchip has integrated I2C and PMBus interfaces for flexible configuration and monitoring.

Read more...
When it comes to long-term reliability of RF amplifier ICs, focus first on die junction temperature
Altron Arrow Editor's Choice Telecoms, Datacoms, Wireless, IoT
When considering the long-term reliability of integrated circuits, a common misconception is that high package or die thermal resistance is problematic. However, high or low thermal resistance, by itself, tells an incomplete story.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved