29 June 2022
Manufacturing / Production Technology, Hardware & Services
Indium Corporation has expanded its portfolio of pastes by introducing two new AuSn solder pastes designed for the higher processing temperatures and assembly needs required for use in high-power LED module array applications such as automotive, infrastructure and horticulture.
High-power LEDs have the ability to provide much higher levels of light output than traditional LEDs while also providing higher levels of performance. This increase in performance causes a large amount of heat to be generated in a localised area and therefore, a high-melting point and high-reliability solder is required for assembly.
It is also critical to the LED assembly process that the solder interface between the diode and its substrate is void-free in order to generate a stable transmission of light and allow for the transfer of the heat generated by the diodes, so that the temperature stability of the device is maintained.
AuLTRA 3.2 and AuLTRA 5.1 are AuSn solder pastes specifically formulated to accommodate higher processing temperatures while providing high reliability. Both pastes offer air or nitrogen reflow, superb wetting, low voiding and a long open life with reduced waste. In addition, AuLTRA 3.2 offers water-soluble flux whilst AuLTRA 5.1 offers no-clean residue.
Both pastes are offered in a variety of AuSn alloys and powder sizes. In addition to being ideal for use in high-power LED module array applications, AuLTRA 3.2 and AuLTRA 5.1 are applicable for all AuSn paste applications.
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