Samtec offers a broad and versatile line-up of high-speed board-to-board products to meet the requirements of most applications. These products support a variety of designs, including backplane applications, connectors that operate in rugged environments, bleeding-edge high-speed (up to 112 Gbps PAM4), extreme density needs, products with integrated ground planes and edge card products.
The latest implementation of the Flexible Stacking Solutionator created a way to find a flexible stacking mated set in under a minute. The same has now been implemented with the high-speed board-to-board products with the High-Speed Board-to-Board Solutionator. These tools present a full mated set solution, removing the guesswork on what goes on the other end of a connector that has been chosen.
The software tool asks up to five questions to narrow down your choices, with results being displayed after the first three questions have been answered. The steps to choosing a connector set are:
1. Choose the connector type.
2. Choose the required orientation from the options of parallel, perpendicular and co-planar.
3. Select the desired pitch in millimetres or inches.
High-speed high-density connectors from Withwave RFiber Solutions
Interconnection
The high-speed high density open pin field array connectors have excellent higher bandwidth applications and are capable of data throughput of up to 112 Gbps.
Read more...Low-PIM cable assembly application considerations RF Design
Interconnection
Given the diverse range of applications for coaxial cable assemblies, these cables are not one-size-fits-all. This article discusses three main types, low-PIM, low-loss, and phase-stable coaxial cable assemblies.
Read more...The new VITA 90 landing page
Interconnection
Samtec has launched its new landing page for the small form factor VITA 90 standard comprising rugged modules with a focus on size, weight and power.
Read more...The new VITA 90 landing page Spectrum Concepts
Interconnection
Samtec has launched its new landing page for the small form factor VITA 90 standard comprising rugged modules with a focus on size, weight and power.
Read more...New precision standoffs for ultra-rugged applications Spectrum Concepts
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Samtec has launched its new precision PCB standoffs used to either separate printed circuit boards, or to create space between the PCB and the mounting chassis.
Read more...Samtec has reorganised its AcceleRate products online Spectrum Concepts
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Samtec recently reorganised its family of AcceleRate products into one webpage to enable easier browsing and comparison of products when trying to find the best high-performance solution for the given application.
Read more...Samtec high-speed interconnects in next-gen UAS Spectrum Concepts
Interconnection
The unmanned aircraft system framework 2.0 autopilot platform utilises several of Samtec’s high-speed board-to-board interconnects for the transfer of data between various add-on boards.
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