The MIL-HD2 connector series from Amphenol is the company’s next-generation, SOSA-aligned solution engineered to meet the most demanding requirements of modern military embedded systems. The connectors are ideally suited for applications in embedded computing, radar, electronic warfare, and high-speed communications systems.
The MIL-HD2 series has been developed to support next-generation switch and payload card designs, where tighter card pitches and reduced chassis footprints are critical. Available in 3-, 4-, and 6-pair configurations, it provides the highest number of differential pairs currently available in a 3U form factor at 56 Gb/s PAM4 speeds.
Engineered for high-speed signal integrity, the MIL-HD2 series incorporates proprietary crosstalk reduction technologies, improved impedance matching, and proven EMI performance. Its compact 1,80 mm pitch enables exceptional density, supporting between 28 and 84 differential pairs per inch. The design also features a 15,7 mil drill-compliant pin that allows for deeper backdrilling.
Mechanical and reliability enhancements include shielded contacts that mate ahead of signal contacts, delivering up to 4 mm of wipe for improved connection integrity, as well as support for hot-plugging in mission-critical environments.
AI-ready edge MPU for HMIs Future Electronics
DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.
Read more...Java Card-based solution Future Electronics
Analogue, Mixed Signal, LSI
The SECORA ID Key S USB, from Infineon Technologies, is a Java Card-based solution with USB and NFC connectivity for secured authentication and digital signatures.
Read more...Connectivity solutions for hydrogen technologies Hiconnex
Interconnection
As the production distribution and utilisation of hydrogen continue to scale, connectivity becomes a key enabler for efficient energy transmission, data communication, and system control.
Read more...Cooling solutions for modern electronics Future Electronics
Passive Components
As electronic systems become more compact and powerful, effective thermal management has become a critical aspect of product design.
Read more...Mixed-density Combo-D connectors Hiconnex
Interconnection
Positronic’s SCBM connector series is a rugged, high-performance family of mixed-density D-sub connectors engineered for demanding environments.
Read more...Same Sky expands rectangular connector portfolio Future Electronics
Interconnection
The portfolio includes male pin headers, female pin headers, and box headers, giving engineers the flexibility to select the most appropriate connector style for their specific design requirements.
Read more...Advanced sensing powers modern drones Future Electronics
DSP, Micros & Memory
Allegro MicroSystems has a portfolio of sensors, motor drivers, and power management devices specifically designed to enhance drone efficiency, reliability, and control.
Read more...Rapid IoT prototyping simplified Future Electronics
Test & Measurement
The STEVAL-MKBOXPRO from STMicroelectronics is a compact, ready-to-use wireless development kit designed to accelerate the creation of intelligent IoT and wearable applications.
Read more...Cortex-M33 performance for cost-sensitive designs Future Electronics
DSP, Micros & Memory
The STM32C5 series from STMicroelectronics introduces a new generation of entry-level microcontrollers engineered to deliver enhanced processing capability, modern security, and cost-effective scalability for connected embedded applications.
Read more...Rugged USB-C for modern designs
Interconnection
Same Sky has expanded its USB Type-C connector portfolio to meet the growing demand for faster data transfer and higher power delivery in modern electronic designs.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version