Powered by Qualcomm Technologies’ premium-tier SoC (System-on-Chip) QCS8250, the module is designed to meet the requirements of high-end AIoT scenarios such as HD video conferences, HD livestreaming, cloud gaming, edge computing, robotics, drones and AR/VR.
The combination of AI and IoT has opened up new possibilities for industries requiring automated real-time decision-making and data analysis. The demand for 5G AIoT solutions is expected to skyrocket, according to Counterpoint Research, with shipments of 5G AIoT modules reaching a CAGR of 84% between 2022 and 2030. Fibocom’s AI smart module is set to play a crucial part in the industry, with the potential to empower a massive range of compute-intensive use cases.
Equipped with the Qualcomm QCS8250 IoT solution, Fibocom’s AI smart module SCA825-W integrates an octa-core Kryo 585 CPU, Adreno 650 GPU, dedicated NPU 230 (Neural Processing Unit), as well as Hexagon DSP for machine learning. The module can deliver a computing power of up to 15 TOPS enabling complex AI computing performance with exceptional features.
Featuring a powerful Spectra 480 ISP (image signal processor), Adreno 995 DPU and Adreno 665 VPU, Fibocom SCA825-W supports up to seven concurrent cameras, triple 4K display and video encoding at up to 4K resolution at 120 fps and 8K at 30 fps, offering superior image capturing, processing and displaying capabilities.
The module supports 5G, Wi-Fi 6.0, Bluetooth 5.1 as well as 2x2 Wi-Fi MIMO multi-antenna technology, which allows various wireless connectivity options for industrial and commercial use cases. It also supports Android 10 operating system and a wide range of interfaces (MIPI-DSI, I2S, PCIe, UART, USB, I2C, SPI), enabling flexibility and ease of integration into AIoT applications.
“With AIoT continuously transforming every industry, high-performance AI modules will become an important pillar,” said Eden Chen, general manager of MC product management department, Fibocom. “Our newly-launched AI smart module SCA825-W is an exceptional part of the Fibocom smart module family, which will take a big step forward in the AIoT field with technological advancements.”
Programmable power and data acquisition modules CST Electronics
DSP, Micros & Memory
TapBus programmable power supply, metering and I/O modules include pre-implemented communication interfaces, automatic addressing, encryption, and configurable access control.
Read more...Raspberry Pi loses a few pounds RS South Africa
DSP, Micros & Memory
The new budget-friendly option halves the existing lowest entry point in terms of RAM, while shaving R240 off the selling price locally.
Read more...Development board supports Arduino and ST Morpho Altron Arrow
DSP, Micros & Memory
The Arduino UNO V3 connectivity support and the ST Morpho headers allow the easy expansion of the functionality of the STM32 Nucleo open development platform with a wide choice of specialised shields.
Read more...New support for Debian OS
DSP, Micros & Memory
NXP has announced the release of Debian 12 based on Linux kernel 6.6.3, which is now available for select i.MX and Layerscape evaluation kits.
Read more...Advanced tech for next-gen cockpit system design Future Electronics
DSP, Micros & Memory
Infineon delivers high-performance microcontrollers, memories, human-machine interface controllers, and automotive-grade security solutions tailored for automotive infotainment systems.
Read more...PIC micros with integrated FPGA features
DSP, Micros & Memory
The new PIC16F131xx microcontrollers from Microchip are ideal for the evolving and miniaturising electronic equipment market, offering efficient power management, and predictable response times for controllers.
Read more...Digital signal controller evolution Altron Arrow
DSP, Micros & Memory
Built around a 32-bit CPU architecture with a 200 MHz operating speed, the dsPIC33A family’s advanced core includes a Double-Precision Floating-Point Unit and DSP instructions for numerically intensive tasks in many closed-loop control algorithms.
Read more...SMD choke for currents up to 48 A Electrocomp
Passive Components
Designed for rated currents from 36 to 48 A, these surface-mountable components from TDK cover a range of inductance values from 2,3 to 8,5 µH.
Read more... Ultra-low power with 32 MHz of performance Future Electronics
DSP, Micros & Memory
The Renesas RA0E1 delivers up to 32 MHz of CPU performance using an Arm Cortex-M23 core with a wide supply voltage range from 1,6 to 5,5 V.
Read more...Precision sensor interface SoC Altron Arrow
DSP, Micros & Memory
The MAX40109 is a low-power, precision sensor interface SoC that includes a high-precision, programmable analogue frontend, and digital signal processing.
printer friendly version