The new Coilcraft XGL1060 series ultra-low loss power inductors reduce DCR by up to 30%. XGL1060 moulded power inductors offer Coilcraft’s lowest DC losses and extremely low power losses for a wide range of DC-to-DC converters. The inductors offer performance benefits including a wider range of inductance values and improved IRMS current ratings.
The XGL1060 currently has the lowest DCR and low power losses in this category and it exhibits high current handling capabilities with soft saturation characteristics.
Thermal aging of the product is not a factor and therefore it is suitable for high temperature applications. The inductor can handle an operating temperature range from -40 to 125°C but, with an AEC-Q200 Grade 1 rating, it can withstand a temperature up to 165°C.
The role of passives in emerging applications
Passive Components
Mouser Electronics has released a new eBook in collaboration with Bourns, exploring the role of passives in emerging electronics applications, including renewables, hybrids, and electric vehicles.
Read more...Updated curve fit equation tool
Passive Components
A new version of Magnetics’ Curve Fit Equation tool, which is an Excel file for design engineers, is now available.
Read more...Updated curve fit equation tool Tamashi Technology Investments
Passive Components
A new version of Magnetics’ Curve Fit Equation tool, which is an Excel file for design engineers, is now available.
Read more...PCB connectors for power systems Phoenix Contact
Passive Components
With the new PC 6 PCB connectors with screw connection, Phoenix Contact’s classic connection technology is available with enhanced touch protection for the new pin connector pattern.
Read more...SPE connector range Phoenix Contact
Passive Components
Single Pair Ethernet (SPE) is a communication technology that realises Industry 4.0 and IIoT applications, and Phoenix Contact’s Combicon range are ideal for SPE connections.
Read more...TDK expands MLCC series RS South Africa
Passive Components
TDK Corporation has expanded its CGA series of multilayer ceramic capacitors, currently being the highest capacitance in 100 V products for automotive applications.
Read more...SiP supports LTE/NB-IoT and GNSS RF Design
DSP, Micros & Memory
The nRF9151 from Nordic Semiconductor is an integrated System-in-Package that supports LTE-M/NB-IoT, DECT NR+ and GNSS services.
Read more...Nordic expands nRF91 series RF Design
DSP, Micros & Memory
Nordic Semiconductor has announced the expansion of its nRF91 series cellular IoT devices with the introduction of the nRF9151 System-in-Package (SiP).
Read more...LEXI-R10 series cellular module RF Design
Telecoms, Datacoms, Wireless, IoT
The LEXI-R10 Series from u-blox are LTE Cat 1 bis modules that support multi-band LTE-FDD, and are designed for size-constrained devices.