A new vision technology from Mycronic is bringing faster cycle times and higher resolution to 3D automated optical inspection (AOI).
Rapid electrification is causing a massive change within the electronics manufacturing industry. From electric vehicles to industrial robotics to power control systems, the world is witnessing the rollout of advanced electronics each more specialised and advanced than the previous. Manufacturing processes require the highest levels of quality, reliability and consistency to produce these advanced circuits. The latest vision system from Mycronic achieves a faster, sharper, and smarter path towards this goal.
The company’s latest contribution to this effort is aimed at the heart of one of its key limiting factors: the speed and accuracy of 3D AOI inspection. With its new Iris 3D AOI vision technology, it’s now possible to achieve the industry’s highest resolution 3D image capture at cycle times up to 30% faster than with previous inspection systems.
“To be clear,” explains Alexia Vey, product manager at Mycronic, “this is a speed increase of 30% for the full inspection cycle, from image acquisition to processing. Considering the system also handles nearly twice as many pixels, this is quite a remarkable performance improvement.”
Key to enabling this next-generation Iris technology is a range of best-in-class laser scanners, image sensors, lighting and computing systems. To expand the system’s field of view by 33%, a faster 3D laser sensor has been combined with improved telecentric optics. When it comes to resolution, the Iris system includes a new image sensor capable of capturing pixel sizes of 13,7 µm, resulting in an astounding 3,45 µm XY measurement resolution using sub-pixel technology. Together, these and other enhancements amount to a combination of speed, accuracy and coverage that is unmatched by any other system on the market.
Iris integrates a new generation of more powerful graphic processors, together with more efficient 3D construction algorithms. This increased processing allows the captured images to be processed at manufacturing takt time. As a result, the system achieves a wider test coverage and enhanced review images for components as small as 008004/0201M.
Iris 3D AOI vision technology is available as standard on all new MYPro I series 3D AOI systems. It is also available as a retrofit kit for existing K series 2D AOIs in need of an upgrade to 3D, as well as for K series 3D AOIs that demand improved processing speed.
Outscale your competition
Manufacturing / Production Technology, Hardware & Services
Attendees will be able to explore the benefits of AMD Kintex UltraScale+ Gen 2 FPGAs in high-performance Pro AV, test & measurement, industrial, and medical applications.
Read more...MTN SA Foundation drives youth pathways into the digital economy
Manufacturing / Production Technology, Hardware & Services
The MTN SA Foundation, in partnership with Helios Towers and Datacomb Development Hub, has launched the MTN–Helios Towers 12-month ICT Learnership Programme, a pathway that takes young South Africans from digital training into real workplace experience.
Read more...The impact of harsh environments and ionic contamination on post-reflow circuit assemblies MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.
Read more...Engineering copper grain structure for high-yield hybrid bonding in 3D packaging Testerion
Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.
Read more...Understanding solder dross: causes and control strategies Truth Electronic Manufacturing
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.
Read more...Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.
Read more...The causes of solder balls in robotic soldering
Manufacturing / Production Technology, Hardware & Services
Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.
Read more...Material challenges for superconducting quantum chips
Manufacturing / Production Technology, Hardware & Services
To achieve the scalable and repeatable production of superconducting circuits for quantum technology products, players in the industry are leveraging semiconductor fabrication techniques.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.