World’s first MCU Edge-AI developer cloud
28 February 2023
DSP, Micros & Memory
STMicroelectronics is continuing to expand its solutions for embedded AI developers and data scientists with a new, industry-first set of tools and services to get edge AI technology on the market faster, and with less complexity, by aiding hardware and software decision-making. The STM32Cube.AI Developer Cloud opens access to an extensive suite of online development tools built around the industry-leading STM32 family of microcontrollers (MCUs).
Serving the growing demand for edge AI-based systems, the STM32Cube.AI desktop front-end includes the resources for developers to validate and generate optimised STM32 AI libraries from trained neural networks. This is now complemented by the STM32Cube.AI Developer Cloud, an online version of the tool, delivering a range of industry-firsts:
• An online interface to generate optimised C-code for STM32 microcontrollers, without requiring prior software installation. Data Scientists and developers benefit from the STM32Cube.AI’s proven neural network optimisation performance to develop edge-AI projects.
• Access to the STM32 model zoo, a repository of trainable deep-learning models and demos to speed application development. At launch, available use cases include human motion sensing for activity recognition and tracking, computer vision for image classification or object detection, and audio event detection for audio classification. Hosted on GitHub, these enable the automatic generation of ‘getting started’ packages optimised for STM32.
• Access to the world’s first online benchmarking service for edge-AI neural networks on STM32 boards. The cloud-accessible board farm features a broad range of STM32 boards, refreshed regularly, allowing data scientists and developers to remotely measure the actual performance of the optimised models.
The STM32Cube.AI Developer Cloud is now available at https://stm32ai-cs.st.com to all registered MyST users.
Further reading:
1 GHz crossover MCU with Arm Cortex Cores
Future Electronics
DSP, Micros & Memory
i.MX RT1170 Crossover MCUs, from NXP Semiconductor, are dual-core devices featuring an Arm Cortex-M7 and Arm Cortex-M4 for real-time microcontroller (MCU) performance and high integration for automotive, industrial and IoT applications.
Read more...
NECTO studio update 7.5.0
DSP, Micros & Memory
MIKROE have continued their collaboration with Renesas by introducing support for the RL78 architecture in NECTO Studio, expanding the IDE beyond its existing MCU platforms.
Read more...
UFS 5.0 flash for on-device AI
EBV Electrolink
DSP, Micros & Memory
UFS 5.0 embedded flash memory solutions, designed to deliver the performance, efficiency and capacity required for the next generation of AI-enabled mobile and edge devices.
Read more...
Accelerate development of physical AI deployments
Altron Arrow
DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
Read more...
AI-ready edge MPU for HMIs
Future Electronics
DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.
Read more...
Industrial-grade ESP32-S3 controller
DSP, Micros & Memory
Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.
Read more...
Universal NFC device
Altron Arrow
DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
Read more...
Compact low-power 32-bit platform
EBV Electrolink
DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.
Read more...
Bridging the gap between prototype and production
DSP, Micros & Memory
Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.
Read more...
Low-power memory born for edge AI
iCorp Technologies
DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.
Read more...