The Consumer Electronics Show, that took place in January 2023, highlighted the importance of the new Matter protocol with the smart home being a prominent part of the event. For the first time, attendees could interact with real-world products equipped with Matter.
Version 1.0 of the Matter standard, which was made public by the Connectivity Standards Alliance in 2022, now includes seven device types ready for certification and will be expanded to include more categories within the next year. As a result, companies have moved quickly to develop and introduce products that are either already Matter certified or about to be.
Matter is getting so much attention because it brings to the smart home something that’s been missing since the beginning – hassle-free interoperability. Matter makes it possible for devices from different manufacturers to connect securely and effortlessly from the get-go and work across smart home platforms or ecosystems such as Amazon, Apple, Google and Samsung SmartThings. By making it easier to set up, protect, expand, and maintain a home network, Matter will broaden the appeal of the smart home and will help transition it from a niche market, mostly driven by tech enthusiasts, into the mainstream, where consumers with little to no technical expertise can enjoy the advantages of a secure, connected home environment.
In addition to the Matter-certified devices and controllers that were on display at CES, there were several demos that let attendees experience what Matter can do for the smart home. At the NXP booth, a demonstration of a virtual smart home with Matter as an enabler of secure interoperability across end nodes, routing devices, Matter controllers and Thread border routers was shown. The system demonstrated multiple options for control with third party ecosystems (Google Nest Hub, Apple HomePod Mini), and local voice control.
More room to scale Altron Arrow
Power Electronics / Power Management
With the latest STM32H5 lines from STMicroelectronics, you can now scale within the same platform, from a compact 1 Mbyte device to higher-memory MCUs for graphics-rich and feature-heavy designs.
Read more...Multi-constellation GNSS module in a legacy-compatible footprint Altron Arrow
Telecoms, Datacoms, Wireless, IoT
Telit Cinterion has announced the SE869eK2L, a single-frequency L1 GNSS module designed to help device manufacturers upgrade legacy positioning designs with improved performance and cost efficiency, while preserving design continuity.
Read more...Compact SSI family for industrial automation Altron Arrow
Passive Components
Infineon Technologies has introduced the ISSI20BxxF Solid State Isolator (SSI) family, bringing solid-state isolation technology into high-volume applications traditionally served by photovoltaic isolators (PVIs), photovoltaic relays (PVRs), and electromechanical relays (EMRs).
Read more...Rev 2.0 PolarFire FPGA ethernet sensor bridge Altron Arrow
Computer/Embedded Technology
Smaller, multi-camera platform enables scalable Ethernet architectures for NVIDIA Edge AI systems, while lowering power, cost and integration complexity.
Read more...Universal IR receiver module Altron Arrow
Telecoms, Datacoms, Wireless, IoT
Vishay Intertechnology has introduced a new series of infrared (IR) receiver modules for IR remote control applications, which feature a wide modulation frequency acceptance from 30 kHz to 68 kHz.
Read more...Low profile SMD antenna Altron Arrow
Telecoms, Datacoms, Wireless, IoT
The Havok PCS.06.A antenna, from Taoglas, is a low profile SMD LTE/cellular 4G/3G/2G embedded antenna designed for direct SMD mount on a device PCB.
Read more...Accelerate development of physical AI deployments Altron Arrow
DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
Read more...Universal NFC device Altron Arrow
DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
Read more...Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...SoC brings scalable edge AI to life Altron Arrow
AI & ML
The NXP i.MX 937 applications processor is optimised for performance without excessive power draw and bridges the gap between entry-level chips and high-end processors.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.