DSP, Micros & Memory


SoC small enough to be glued to a tooth

26 April 2023 DSP, Micros & Memory

Designed for the smallest IoT devices, the xG27 and BB50 families range in size from 2 mm2 to 5 mm2. These offer IoT device designers energy efficiency, high performance, trusted security, and in the case of the xG27 family, wireless connectivity. This makes the xG27 SoC family and BB50 MCU ideal for tiny, battery-optimised devices like connected medical devices, wearables, asset monitoring tags, smart sensors, and simple consumer electronics like toothbrushes and toys.

The new xG27 family of SoCs comprises the BG27, for Bluetooth connectivity, and the MG27, supporting Zigbee and other proprietary protocols. Built around the ARM Cortex M33 processor, the BG27 and MG27 share several common features designed to make them the ideal SoC for small form-factor devices.

In one use case, Lura Health, a medical device manufacturer and participant in the Alpha programme for BG27, has already selected the new SoC to form the basis of its new in-development smart wearable. However, unlike other common wearables on the wrist or other external places, the new Lura Health monitor is designed to be fitted into a person’s mouth. Specifically, the device is so small that it is glued to a tooth. With the device, dentists and other clinicians can collect important data from saliva, which is used to test for over 1000 health conditions.

“The BG27 is amazing because it’s small enough that we can develop an IoT sensor smaller than a tooth, the power consumption is low enough to remove battery life as a product constraint, it has enough memory to store a sophisticated firmware application, it allows us to perform the data analysis required to gain insightful information from what we are monitoring, and it has all the peripherals we need to interface with our sensors,” said Noah Hill, co-Founder and CTO of Lura Health. “We spent hundreds of hours searching for a microcontroller that meets our needs, and the BG27 is the only solution that checks every box.”

The BG27 and MG27 open and extend a wide range of possible applications and use cases.

For more information contact NuVision Electronics, +27 11 608 0144, sales@nuvisionelec.co.za, www.nuvisionelec.com


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Flash memory devices for high-capacity mobile storage
DSP, Micros & Memory
KIOXIA has begun sampling new Universal Flash Storage Ver. 4.1 embedded memory devices with 4-bit-per-cell, quadruple-level cell technology.

Read more...
Microchip expands maXTouch M1 touchscreen controller
Altron Arrow DSP, Micros & Memory
Microchip Technology has again expanded its maXTouch M1 family of touchscreen controllers, now covering free-form widescreen format displays up to 42 inches down to small compact screens in the 2 to 5 inch range.

Read more...
SoC with improved processing and efficiency
Future Electronics DSP, Micros & Memory
The nRF54L Series of 2,4 GHz SoCs from Nordic Semiconductor is an upgrade on the previous nRF52 Series and offers advanced Bluetooth connectivity, improved processing power and efficiency, and high security capabilities.

Read more...
Microchip expands its Arm Cortex-M0+ portfolio
Altron Arrow DSP, Micros & Memory
PIC32CM PL10 MCUs feature a rich set of Core Independent Peripherals, 5 V operation, touch capabilities, integrated toolsets, and safety compliance.

Read more...
1 GHz crossover MCU with Arm Cortex Cores
Future Electronics DSP, Micros & Memory
i.MX RT1170 Crossover MCUs, from NXP Semiconductor, are dual-core devices featuring an Arm Cortex-M7 and Arm Cortex-M4 for real-time microcontroller (MCU) performance and high integration for automotive, industrial and IoT applications.

Read more...
NECTO studio update 7.5.0
DSP, Micros & Memory
MIKROE have continued their collaboration with Renesas by introducing support for the RL78 architecture in NECTO Studio, expanding the IDE beyond its existing MCU platforms.

Read more...
Secure, low-power Bluetooth LE SoC
NuVision Electronics Telecoms, Datacoms, Wireless, IoT
Silicon Labs unveils BG2B, its lowest-power Bluetooth LE SoC with industry-leading power efficiency, security, and integration.

Read more...
UFS 5.0 flash for on-device AI
EBV Electrolink DSP, Micros & Memory
UFS 5.0 embedded flash memory solutions, designed to deliver the performance, efficiency and capacity required for the next generation of AI-enabled mobile and edge devices.

Read more...
Accelerate development of physical AI deployments
Altron Arrow DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N- AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.

Read more...
AI-ready edge MPU for HMIs
Future Electronics DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved