Designed for the smallest IoT devices, the xG27 and BB50 families range in size from 2 mm2 to 5 mm2. These offer IoT device designers energy efficiency, high performance, trusted security, and in the case of the xG27 family, wireless connectivity. This makes the xG27 SoC family and BB50 MCU ideal for tiny, battery-optimised devices like connected medical devices, wearables, asset monitoring tags, smart sensors, and simple consumer electronics like toothbrushes and toys.
The new xG27 family of SoCs comprises the BG27, for Bluetooth connectivity, and the MG27, supporting Zigbee and other proprietary protocols. Built around the ARM Cortex M33 processor, the BG27 and MG27 share several common features designed to make them the ideal SoC for small form-factor devices.
In one use case, Lura Health, a medical device manufacturer and participant in the Alpha programme for BG27, has already selected the new SoC to form the basis of its new in-development smart wearable. However, unlike other common wearables on the wrist or other external places, the new Lura Health monitor is designed to be fitted into a person’s mouth. Specifically, the device is so small that it is glued to a tooth. With the device, dentists and other clinicians can collect important data from saliva, which is used to test for over 1000 health conditions.
“The BG27 is amazing because it’s small enough that we can develop an IoT sensor smaller than a tooth, the power consumption is low enough to remove battery life as a product constraint, it has enough memory to store a sophisticated firmware application, it allows us to perform the data analysis required to gain insightful information from what we are monitoring, and it has all the peripherals we need to interface with our sensors,” said Noah Hill, co-Founder and CTO of Lura Health. “We spent hundreds of hours searching for a microcontroller that meets our needs, and the BG27 is the only solution that checks every box.”
The BG27 and MG27 open and extend a wide range of possible applications and use cases.
Cost-effective microcontroller series Altron Arrow
DSP, Micros & Memory
The STM32C5 series from STMicroelectronics delivers an excellent balance of performance, efficiency, and affordability for embedded designs that require more capability without increasing bill of materials cost.
Read more...Battery-friendly Thread and BLE solution iCorp Technologies
DSP, Micros & Memory
Positioned as an incremental upgrade to the ESP32-H2, Espressif’s ESP32-H21 adds an integrated DC-DC converter that reduces active current draw and helps extend battery life in power-sensitive consumer and industrial devices.
Read more...Next generation HMI processing platform Future Electronics
DSP, Micros & Memory
Microchip’s latest hybrid MCU SiP integrates an Arm926EJ-S processor with 512 Mb of DDR2 SDRAM and is engineered to meet the rising demand for sophisticated HMI solutions in modern vehicles.
Read more...Low-power SoC for IoT designs iCorp Technologies
DSP, Micros & Memory
Espressif’s ESP32-H4 is a dual-core 32-bit RISC-V SoC designed for battery-powered wireless products that require low energy consumption, strong security, and modern connectivity.
Read more...Chip for high-density power Future Electronics
DSP, Micros & Memory
Microchip’s dsPIC33AK256MPS306 Digital Signal Controllers combine high-resolution control, high-speed analogue, and security with support for post-quantum cryptography.
Read more...The end of ‘entry-level’: STMicroelectronics’ STM32C5 sets a new baseline for embedded systems
DSP, Micros & Memory
[Sponsored] Instead of incrementally improving legacy Cortex-M0+ architectures, STM32C5 introduces a Cortex-M33-based platform into the entry-level category. This changes not only performance expectations, but also how engineers approach system architecture, consolidation, and long-term scalability.
Read more...GigaDevice expands GD25UF Series density NuVision Electronics
DSP, Micros & Memory
GigaDevice has announced the expanded density range of its GD25UF series 1,2 V ultra-low power SPI NOR Flash, now spanning from 8 Mb to 256 Mb.
Read more...ARINC 429 line driver evaluation board ASIC Design Services
DSP, Micros & Memory
Holt Integrated Circuits have announced the release of the ADK-85104 Evaluation Board, a compact, ready-to-use platform designed to help engineers rapidly evaluate and characterise Holt’s HI-85104.
Read more...Highly integrated 24-channel mixed signal IC EBV Electrolink
DSP, Micros & Memory
Microchip Technology has announced the LX4580, a 24-channel mixed-signal IC designed to replace multiple discrete components with a single device that supports synchronised data acquisition, fault monitoring, and motor control.
Read more...Lower-power Thread and BLE connectivity iCorp Technologies
DSP, Micros & Memory
Espressif has released the ESP32-H21, a low-power wireless SoC aimed at Thread, Matter, Zigbee, and Bluetooth LE device designs.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version