GigaDevice has introduced an SPI NOR Flash product to meet advanced SOCs’ need for ultra-low power and high performance.
The GD25UF products operate at a supply-voltage range of 1,14-1,26 V. This is ideal for devices built on advanced process nodes and operating at a core voltage of 1,2 V, as it provides for a simpler power system architecture, and for direct interfacing between the I/O pins of the SoC or processor and the GD25UF device.
In low-power mode at a frequency of up to 50 MHz, Active Read current can be as low as 0,4 mA. Deep power-down current of 0,1 µA makes the GD25UF ideal for any battery-powered or wearable application.
In Fast Read mode, these Flash devices operate at up to 120 MHz and achieve a data-transfer rate of up to 480 Mbps. In low EMI mode, operating at 60 MHz over a double transfer-rate (DTR) quad I/O interface, the GD25UF achieves the same data-transfer rate of 480 Mbps, while minimising clock-generated noise, an ideal feature for noise-sensitive wireless applications.
Flash memory devices for high-capacity mobile storage
DSP, Micros & Memory
KIOXIA has begun sampling new Universal Flash Storage Ver. 4.1 embedded memory devices with 4-bit-per-cell, quadruple-level cell technology.
Read more...Microchip expands maXTouch M1 touchscreen controller Altron Arrow
DSP, Micros & Memory
Microchip Technology has again expanded its maXTouch M1 family of touchscreen controllers, now covering free-form widescreen format displays up to 42 inches down to small compact screens in the 2 to 5 inch range.
Read more...SoC with improved processing and efficiency Future Electronics
DSP, Micros & Memory
The nRF54L Series of 2,4 GHz SoCs from Nordic Semiconductor is an upgrade on the previous nRF52 Series and offers advanced Bluetooth connectivity, improved processing power and efficiency, and high security capabilities.
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DSP, Micros & Memory
PIC32CM PL10 MCUs feature a rich set of Core Independent Peripherals, 5 V operation, touch capabilities, integrated toolsets, and safety compliance.
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DSP, Micros & Memory
i.MX RT1170 Crossover MCUs, from NXP Semiconductor, are dual-core devices featuring an Arm Cortex-M7 and Arm Cortex-M4 for real-time microcontroller (MCU) performance and high integration for automotive, industrial and IoT applications.
Read more...NECTO studio update 7.5.0
DSP, Micros & Memory
MIKROE have continued their collaboration with Renesas by introducing support for the RL78 architecture in NECTO Studio, expanding the IDE beyond its existing MCU platforms.
Read more...Secure, low-power Bluetooth LE SoC NuVision Electronics
Telecoms, Datacoms, Wireless, IoT
Silicon Labs unveils BG2B, its lowest-power Bluetooth LE SoC with industry-leading power efficiency, security, and integration.
Read more...UFS 5.0 flash for on-device AI EBV Electrolink
DSP, Micros & Memory
UFS 5.0 embedded flash memory solutions, designed to deliver the performance, efficiency and capacity required for the next generation of AI-enabled mobile and edge devices.
Read more...Accelerate development of physical AI deployments Altron Arrow
DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
Read more...AI-ready edge MPU for HMIs Future Electronics
DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.
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