Editor's Choice


IoT made easy

27 September 2023 Editor's Choice Telecoms, Datacoms, Wireless, IoT

Links Field Networks is a global IoT connectivity solution provider and a market leader in SIM technology. With its new generation of SIM technology, and collaboration with mainstream carriers worldwide, it offers turnkey connectivity solution to global IoT enterprises. With an extensive track record in IoT, and millions of connections globally, Links Field Networks takes pride in its ability to provide the best customised 2G/3G/4G/CATM1/NB-IoT connectivity products to each individual IoT use case.

To further enhance its offering, Links Field South Africa has partnered with Mobiletek Communications, to embed the Links Field Global Roaming SIM solution into its modules at firmware level. Mobiletek, founded in 2009, is a communications partner to Lenovo, ZTE and CBN, amongst others.

In 2016 MobileTek launched its own brand to become one of the leading module suppliers to the automatic meter reading, smart metering vertical fields. The company built on this success and forged its way into the track and trace industry where they were one of the first suppliers of an LTE Cat.1 BIS, low-cost module into the IoT space.

The company has now introduced the L510E-3, a Cat.1 LTE (B1,3,8,20,28) module with 2G (B3,8) fallback. Its miniaturised LCC package, with dimensions of 21,5 x 25 x 2,4 mm, makes it ideal for track and trace applications, where small tracking devices are needed. Key features of the module are its industrial temperature range, ultra-low power, optional GNSS and Wi-Fi scanning.

With IoT driving the move to battery-powered devices, together with the boom in smart metering, Mobiletek is at the forefront of LPWAN technology with the L660. This NB-IoT device is only 17,7 x 15,8 x 2,25 mm in size and features ultra-low power with an input voltage range of 2,2 to 4,5 V. The L660 module supports PSM (1,0 µA @ 3,3 V) and eDRx modes.

The partnership between Links Field and MobileTek introduces another key feature, the Links Field SoftSIM capability. No more cumbersome SIM trays with expensive placement costs is necessary. A simple AT command activating the embedded SoftSIM is all that is required.


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Enhance SiC device efficiency using merged-pin Schottky diodes
NuVision Electronics Editor's Choice Power Electronics / Power Management
Silicon carbide (SiC) has advantages over silicon (Si) that make it particularly suitable for Schottky diodes in applications such as fast battery chargers, photovoltaic (PV) battery converters, and traction inverters.

Read more...
What is Wi-Fi HaLow and why choose it for IoT?
iCorp Technologies Editor's Choice Telecoms, Datacoms, Wireless, IoT
Wi-Fi HaLow introduces a low power connectivity option that, in contrast to other Wi-Fi options, offers greater range of approximately 1 km, which opens up a raft of IoT use cases.

Read more...
Simple battery charger ICs for any chemistry
Altron Arrow Editor's Choice Power Electronics / Power Management
The LTC4162 is a highly integrated, high voltage multi-chemistry synchronous monolithic step-down battery charger and PowerPath manager with onboard telemetry functions and optional maximum power point tracking.

Read more...
From the editor's desk: Is the current AI really what we want?
Technews Publishing Editor's Choice
The companies that develop LLMs need to change direction and concentrate on freeing up our time, not so that we can have more time to do the tasks we don’t want to do in the first place, but rather to allow us more time to do what we love.

Read more...
When it comes to long-term reliability of RF amplifier ICs, focus first on die junction temperature
Altron Arrow Editor's Choice Telecoms, Datacoms, Wireless, IoT
When considering the long-term reliability of integrated circuits, a common misconception is that high package or die thermal resistance is problematic. However, high or low thermal resistance, by itself, tells an incomplete story.

Read more...
ICs vs modules: Understanding the technical trade-offs for IoT applications
NuVision Electronics Editor's Choice DSP, Micros & Memory
As the IoT continues to transform industries, design decisions around wireless connectivity components become increasingly complex with engineers often facing the dilemma of choosing between ICs and wireless modules for their IoT applications.

Read more...
Why bis means business for LTE Cat 1 IoT connections
NuVision Electronics Editor's Choice Telecoms, Datacoms, Wireless, IoT
Tomaž Petaros, product manager IoT EMEA at Quectel Wireless Solutions explains why the market for Cat 1bis IoT connections is getting busy.

Read more...
Interview with Brian Aziz, vice president of global sales, Iridium
Editor's Choice
ridium is the leading satellite IoT player. Their network consists of 66 active low Earth orbit satellites covering every inch of the globe and are used for IoT and emergency services worldwide.

Read more...
Accelerating AI adoption in MCU manufacturing
Editor's Choice AI & ML
To gain the value of ML functionality, designers of MCU-based devices have to adopt a new development method and accept a new type of probabilistic rather than deterministic output.

Read more...
Altron Arrow: Empowering innovation with STMicroelectronics AI processors
Altron Arrow Editor's Choice AI & ML
ST’s AI processors are not only smarter and faster, but also incredibly efficient, enabling a new wave of intelligent solutions across multiple industries.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved