The Raspberry Pi Foundation has just announced the new Raspberry Pi 5 SBC, available from the end of October 2023. The R-Pi 5 comes with new features and is over twice as fast as its predecessor, the R-Pi 4, thanks to an upgrade to the main processor.
Changes over the older model include:
• 2,4 GHz quad-core 64-bit Arm Cortex-A76 CPU.
• VideoCore VII GPU, supporting OpenGL ES 3.1, Vulkan 1.2.
• Dual 4Kp60 HDMI display output.
• 4Kp60 HEVC decoder.
• Dual-band 802.11ac Wi-Fi.
• High-speed microSD card interface with SDR104 mode support.
The upgraded Arm Cortex-A76 CPU has four 2,4 GHz cores, effectively improving the performance by 2,5 times. This will come in handy when driving the two 4K display outputs at 60 Hz. Also included are dual four-lane MIPI transceivers, each capable of connecting to either two cameras, two displays, or one of each.
A welcome addition to the R-Pi form factor is the PCIe 2.0 interface. This will allow the addition of a raft of high-speed peripherals that can utilise the interface. At launch, a HAT connecting to the PCIe bus will be available, which will support NVMe SSDs with the M.2 format.
Another new feature is the real-time clock. A battery connector has been provided on the board to allow the clock to keep time when power is removed. This will allow applications to keep time in the absence of a network connection.
Finally, a power button has been included on the side of the SBC. Users will no longer have to connect/disconnect the power supply to boot up or shut down the computer.
The OS has also been given an upgrade to support the new features present in the R-Pi 5.
Quectel’s RG255C-NA and RM255C-GL accelerate 5G RedCap adoption iCorp Technologies
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Quectel’s RG255C-NA and RM255C-GL modules represent a strategic move into this fast-growing segment, delivering Sub-6 GHz 5G connectivity optimised for mid-tier IoT applications.
Read more...SDRs – Which RF architecture should you choose? RFiber Solutions
Editor's Choice Telecoms, Datacoms, Wireless, IoT
There are several common methods of implementing SDR architectures. This paper discusses which is best when meeting a specific need.
Read more...A two-stage approach to super-wide input voltage range DC-DC converters RFiber Solutions
Editor's Choice
Teaser: In addition to handling the various input voltage ranges required, the SynQor line of InQor DC-DC converters are fully encased and ruggedised to handle the harsh environments that often accompany systems that have such challenging technical requirements.
Read more...From the editor's desk: Engineering the future Technews Publishing
Editor's Choice
As we welcome the first issue of Dataweek in a new year, it is an exciting time to be part of the electronics community, especially for our readers. The pace of change across our industry continues to accelerate, reshaping how we design, build, and interact with technology.
Read more...Barracuda commissions new IPC Class 3 aerospace facility Barracuda Holdings
Editor's Choice News
The company has commissioned a new dedicated IPC Class 3 facility in Somerset West. and has concluded a new investment partnership that will provide the capital and management capacity required to scale operations.
Read more...Engineering copper grain structure for high-yield hybrid bonding in 3D packaging Testerion
Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.
Read more...Understanding solder dross: causes and control strategies Truth Electronic Manufacturing
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version