SolidRun has recently announced the launch of its new Ryzen V3000 CX7 Com module, configurable with the eight-core/16-thread Ryzen Embedded V3C48 processor. Boasting AMD’s state-of-the-art 6 nm ‘Zen3’ architecture, this ultra-powerful embedded solution offers industry-leading performance and power efficiency. As SolidRun’s first x86-based Com Express 7 module, the Ryzen V3000 CX7 Com module ushers in a new era of efficient, high-performance computing for a diverse range of networking and edge applications.
“Our new Ryzen V3000 CX7 Com module is an exciting addition to our CX7 product line, as it represents a significant leap forward in embedded computing, and offers unmatched performance and scalability for networking and edge applications,” said Dr Atai Ziv, CEO at SolidRun. “By leveraging the power of AMD’s Ryzen Embedded V3000 processor, we are empowering developers to create innovative solutions that meet the evolving demands of modern embedded computing.”
Based on the AMD Ryzen Embedded V3000 processor, SolidRun’s Ryzen V3000 CX7 Com module brings unparalleled processing power, thermal efficiency, and high-speed I/O connectivity to the COM Express Type 7 form factor. This innovative embedded module delivers exceptional CPU performance, scalability, and reliability, making it ideal for a wide range of storage, networking, and edge systems.
In addition to its powerful processing capabilities, the Ryzen V3000 CX7 Com module from SolidRun boasts a comprehensive suite of integrated I/O interfaces. With support for up to 20 lanes of PCIe Gen4, developers can leverage high-speed data transfer for networking, storage, and acceleration purposes. The inclusion of dual 10 Gb Ethernet MAC provides best-in-class connectivity for networking applications, ensuring reliable and high-bandwidth data transmission. Furthermore, the module supports up to 96 GB of dual-channel 64-bit DDR5 memory (ECC/non-ECC), enabling efficient memory utilisation and enhanced data integrity. These integrated features make the Ryzen V3000 CX7 Com module well-suited to demanding networking, edge computing, and storage applications, where high performance, reliability, and scalability are paramount.
Compact 6 A automotive buck converter Altron Arrow
Power Electronics / Power Management
Delivering up to 6 A of continuous output current, the DCP0606Y from STMicroelectronics enables efficient regulation of low-voltage rails commonly used in modern vehicle electronics and industrial systems.
Read more...Next-gen modules for rugged edge AI systems Altron Arrow
Computer/Embedded Technology
Designed for real-world edge deployments where systems do not sit still, SolidRun’s P100 COMx6 series targets mobile platforms as well as harsh, mission-critical environments.
Read more...Fanless multimedia edge PC Vepac Electronics
Computer/Embedded Technology
Dual 4K display capabilities, ultra-efficient processing, and versatile mounting options make the Intelli TWL01 Edge the ultimate embedded platform for multimedia solution building.
Read more...Fanless multimedia edge PC Future Electronics
Computer/Embedded Technology
Dual 4K display capabilities, ultra-efficient processing, and versatile mounting options make the Intelli TWL01 Edge the ultimate embedded platform for multimedia solution building.
Read more...A software-based controller for the industrial future Phoenix Contact
Computer/Embedded Technology
With Virtual PLCnext Control, Phoenix Contact is launching a software-based controller solution that enables flexible automation functions in virtualised IT environments.
Read more...NXP has expanded its MCX A Series Altron Arrow
AI & ML
NXP has significantly expanded its MCX A Series of Arm Cortex-M33 microcontrollers, doubling the portfolio with six new families aimed at industrial and IoT edge applications.
Read more...5G mobile hotspot with integrated multimodal AI capabilities CST Electronics
Computer/Embedded Technology
MeiG Smart has launched its first 5G Mobile HotSpot solution, the SRT8710, a breakthrough in mobile connectivity that combines ultra-fast 5G communications with integrated multimodal artificial intelligence functions.
Read more...Exploring Bluetooth Channel Sounding Altron Arrow
Telecoms, Datacoms, Wireless, IoT
NXP has enabled BCS on the MCX W72 multi-protocol wireless MCU, which supports Bluetooth Low Energy 6.0, Thread, Zigbee, and Matter.
Read more...Panasonic TOUGHBOOK 33 2-in-1 detachable Vepac Electronics
Computer/Embedded Technology
The Panasonic TOUGHBOOK 33 is a fully rugged 12-inch 2-in-1 detachable notebook designed to deliver unmatched flexibility, durability, and performance for mobile professionals working in demanding environments.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version