Telecoms, Datacoms, Wireless, IoT


3D depth sensing sensor

28 March 2024 Telecoms, Datacoms, Wireless, IoT

STMicroelectronics has expanded into 3D depth sensing with their latest time-of-flight sensors. A recent announcement has revealed an all-in-one, direct Time-of-Flight (dToF) 3D LiDAR (Light Detection And Ranging) module with 2,3k resolution, and an early reveal for what is currently the world’s smallest 500k-pixel indirect Time-of-Flight (iToF) sensor.

The VL53L9 is a direct ToF 3D LiDAR device with a resolution of up to 2,3k zones. Integrating a dual scan flood illumination, which is unique in the market, the LiDAR can detect small objects and edges, and captures both 2D infrared (IR) images and 3D depth map information. It comes as a ready-to-use low-power module with its on-chip dToF processing, requiring no extra external components or calibration. The VL53L9 delivers state-of-the-art ranging performance from 5 cm to 10 metres.

The module’s suite of features elevates camera-assist performance, supporting macro up to telephoto photography. It enables features such as laser autofocus, bokeh, and cinematic effects for still and video at 60 fps. Virtual reality systems can leverage accurate depth and 2D images to enhance spatial mapping for more immersive gaming and other VR experiences. The sensor’s ability to detect the edges of small objects at short and ultra-long ranges makes it also suitable for applications like SLAM (simultaneous localization and mapping).


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

SMT-mountable card connectors
Telecoms, Datacoms, Wireless, IoT
Würth Elektronik introduces four new SMT-mountable Nano SIM and microSD card connectors and expands its range with solutions for the smallest packages.

Read more...
Module for smart city and smart utility devices
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has launched the Quectel KCM0A5S, a high-performance Wi-SUN module designed for smart applications such as street lighting, precision agriculture, industrial IoT, smart meters and smart cities.

Read more...
Ultra-low-power wireless module
Altron Arrow Telecoms, Datacoms, Wireless, IoT
The STM32WBA5MMG from STMicroelectronics is an ultra-low-power, small form factor, certified 2,4 GHz wireless module that supports Bluetooth LE, Zigbee 3.0, OpenThread, and IEEE 802.15.4 proprietary protocols.

Read more...
MCX C Series development board
Avnet Silica DSP, Micros & Memory
The FRDM-MCXC444 is a compact and scalable development board for rapid prototyping of MCX C444 MCU from NXP Semiconductors.

Read more...
Quectel partners with GEODNET
Quectel Wireless Solutions Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has partnered with GEODNET to deliver Quectel’s Real-Time Kinematic (RTK) correction services, enabling high-precision positioning for IoT applications.

Read more...
Bringing Bluetooth Channel Sounding to automotive and beyond with KW47
Altron Arrow Telecoms, Datacoms, Wireless, IoT
NXP’s new Channel Sounding-certified KW47 and MCX W72 wireless MCUs are set to help automakers with distance measurement, bringing an additional ranging solution for car access and autonomous systems, and will be utilised across a broader spectrum of applications.

Read more...
Dual-band GNSS antenna
RF Design Telecoms, Datacoms, Wireless, IoT
The Taoglas Accura GVLB258.A, is a passive, dual-band GNSS L1/L5, high-performance antenna for high precision GNSS accuracy and fast positioning.

Read more...
Cutting-edge hybrid capacitors
Avnet Silica Passive Components
Panasonic Industry recently announced the launch of the ZVU Series Hybrid Capacitors, a cutting-edge solution tailored to meet the escalating demands of advanced electronic systems.

Read more...
What is Wi-Fi HaLow and why choose it for IoT?
iCorp Technologies Editor's Choice Telecoms, Datacoms, Wireless, IoT
Wi-Fi HaLow introduces a low power connectivity option that, in contrast to other Wi-Fi options, offers greater range of approximately 1 km, which opens up a raft of IoT use cases.

Read more...
Wi-Fi 6 and Bluetooth LE coprocessor module
Altron Arrow Telecoms, Datacoms, Wireless, IoT
The ST67W611M1 from STMicroelectronics boasts an all-in-one design which, together with its capabilities, contribute to making it an attractive choice for IoT edge devices requiring a single-chip solution.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved