STMicroelectronics released new devices from the second generation of its industrial MPUs, the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure. These are ST’s first MPUs to contain a 64-bit CPU, the Arm Cortex-A35, which runs up to 1,5 GHz. The CPU is the centre of the processing engine that also contains a Cortex-M33 core. In addition, there is a GPU, a neural processor (NPU), and a video processor. AI workloads can run on the CPU, GPU, or NPU, depending on processor loading and application demands, for optimal performance and energy efficiency.
State-of-the-art security of the new STM32MP2 devices leverages ST’s proprietary secure hardware, anti-tamper controls, protected firmware, and secure provisioning, working with Arm’s TrustZone architecture, to keep sensitive data and keys secret. Certified to SESIP Level 3, STM32MP2 MPUs can satisfy forthcoming tougher cyber-protection requirements in key territories worldwide.
Compact low-power 32-bit platform EBV Electrolink
DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.
Read more...Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...SoC brings scalable edge AI to life Altron Arrow
AI & ML
The NXP i.MX 937 applications processor is optimised for performance without excessive power draw and bridges the gap between entry-level chips and high-end processors.
Read more...Wall-mount cooling for Edge IT
AI & ML
Designed to run 24/7 in critical compute environments, Vertiv CoolPhase Wall delivers up to 60% greater airflow than comfort cooling.
Read more...Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
Opto-Electronics Electronics Technology AI & ML
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...Edge AI improves condition monitoring EBV Electrolink
AI & ML
STMicroelectronics has introduced the IIS3DWB10IS, an intelligent MEMS vibration sensor designed for high-performance industrial condition monitoring applications.
Read more...Industrial time-of-flight proximity sensor EBV Electrolink
Opto-Electronics
STMicroelectronics’ VL53L4ED is a compact, high accuracy time-of-flight proximity sensor designed for industrial and embedded applications that require precise short range distance measurement.
Read more...Tiny SoM integrates NXP i.MX 91
AI & ML
The QS91 module from Direct Insight utilises the low-cost single core i.MX 91 to deliver secure, energy-efficient Linux capabilities for edge applications.
Read more...Robotics platform powers intelligent systems Vepac Electronics
AI & ML
The CEXD-INTRBL open robotics development system combines high-performance AI processing, sensor integration, and motion control into a compact embedded platform.
Read more...Ultra-low-power smart metering EBV Electrolink
Analogue, Mixed Signal, LSI
ScioSense’s UFC23 sensor combines improved resolution and offset stability with ultra-low standby current, enabling high-end battery-powered water, heat, gas and leak detection meter designs.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.