KIOXIA Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.
Unveiled at ISSCC 2025, the new 3D flash memory innovation, together with the companies’ revolutionary CBA (CMOS directly Bonded to Array) technology, incorporates one of the latest interface standards, Toggle DDR6.0 for NAND flash memory. The new innovation also leverages the SCA (Separate Command Address) protocol, a novel command address input method of its interface, and PI-LTT (Power Isolated Low-Tapped Termination) technology, which is instrumental in further reducing power consumption.
Leveraging this unique high-speed technology, the companies expect the new 3D flash memory to achieve a 33% improvement in NAND interface speed compared with their 8th generation 3D flash memory currently in mass production, reaching a 4,8 Gb/s interface speed. The technology can also deliver enhanced power efficiency of data input/output, reducing power consumption by 10% for input and 34% for output, thereby achieving a balance of high performance and low power consumption.
Previewing the 10th generation 3D flash memory, the companies detailed that by increasing the number of memory layers to 332 and optimising the floor plan for increased planar density, the technology improves bit density by 59%.
PolarFire SoC FPGAs achieve AEC-Q100 qualification ASIC Design Services
DSP, Micros & Memory
Microchip Technology’s PolarFire SoC FPGAs have earned the Automotive Electronics Council AEC-Q100 qualification.
Read more...Integrated STM32WBA6 wireless microcontrollers Altron Arrow
DSP, Micros & Memory
Cost-efficient and highly integrated embedded controllers for emerging 2,4 GHz wireless applications in smart home, health, factory, and agriculture.
Read more...Ultra-low-power MCU with FPU Arm Cortex-M33 Altron Arrow
DSP, Micros & Memory
STMicroelectronics has expanded its STM32 ultra-low-power family with the launch of the STM32U3 for cost-sensitive applications in industrial, medical, and consumer electronics devices.
Read more...Low-jitter oscillators
DSP, Micros & Memory
The JOH21, JOE21 and JOD21 low-jitter oscillators with differential output are designed for applications that require accurate timing and precise synchronisation.
Read more...Raspberry Pi 5 SBC Electrocomp Express
DSP, Micros & Memory
The Raspberry Pi 5 single board computer builds on the phenomenal success of its predecessor, the Raspberry Pi 4, delivering a 2-3x increase in CPU performance.
Read more...The world’s first RISC-V MCU to achieve PSA-L2 iCorp Technologies
DSP, Micros & Memory
Espressif’s ESP32-C6 is the world’s first RISC-V MCU to achieve PSA-L2 security certification, security certification, underscoring the company’s commitment to delivering robust, secure, and reliable IoT solutions.
Read more...32 Mbit SRAM chip Brabek
DSP, Micros & Memory
To meet the demand for high-density fast CMOS SRAM, Alliance Memory has introduced a new 32 Mbit device in the 6 x 8 mm 48-ball FBGA package, which offers a wide power supply range from 1,65 to 3,6 V.
Read more...Connectivity for industrial applications iCorp Technologies
DSP, Micros & Memory
Quectel has introduced the SG882G, its latest flagship Android/Linux smart module, designed to deliver exceptional computing power, multimedia capabilities, and seamless connectivity for industrial and consumer applications.
Read more...Battery monitoring and balancing IC EBV Electrolink
Power Electronics / Power Management
The TLE9009DQU from Infineon is a multi-channel battery monitoring and balancing IC crafted for Li-Ion battery packs.
Read more...Eval board for MEMS sensors Altron Arrow
DSP, Micros & Memory
ST’s STEVAL-MKI109D is an evaluation platform that allows engineers to monitor the behaviour of ST MEMS sensors and maximise the performance of new product designs, accelerating time to market.
printer friendly version