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AI & ML

• Development kit for AI and edge applications

• From the editor's desk: Groq – the future of AI processing?
• AI-powered weather forecasts across Africa

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Analogue, Mixed Signal, LSI

• A new era in modular I/O solutions

• High voltage instrument op-amp

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Circuit & System Protection

• Clearing the Static: Conductive foot, heel and shoe grounders

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Computer/Embedded Technology

• Unlock enhanced wireless performance

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Design Automation

• MPLAB PICkit Basic

• MPLAB unified compiler licenses

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DSP, Micros & Memory

• Artificial intelligence meets embedded development
• Chipset enables ultra-wide signal capture
• Embedded module for AI vision applications
• Evaluation kit for ML applications
• High-speed Flash for SoC applications

• KIOXIA pioneer new 3D Flash technology
• Microprocessors with advanced graphics and connectivity
• SoC for real-time AI at the edge
• ST MCUs extend ultra-low power innovation
• Super-fast H.264 encoder FPGA core
• High reliability memories

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Enclosures, Racks, Cabinets & Panel Products

• Building the control panels of the future
• Flexible and high-density heat rejection system

• High visibility 4-digit panel ammeters
• Multi-channel SMPS cable assemblies
• What’s the big deal with DPL?

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Events

• Tech Talks – Enabling AI/ML at the edge

• Webinar - How to develop intelligent edge IoT devices

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Interconnection

• Configurable DIN rail housings

• mBend cable assemblies
• What’s the big deal with open pin fields?

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Manufacturing / Production Technology, Hardware & Services

• G-Tera high-speed SMT printer
• Microtronix powers up 2025 with smart meter production for Eskom
• Next-generation SPI and AOI series
• Reliable X-ray inspection system

• The factory beat
• The ultimate range for design and repair
• Yamaha’s Advanced Safety Package eases factory-safety
• Design & Repair range from RS Pro
• Extending AI assistance in AOI

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Opto-Electronics

• Easy Nixie tube display

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Passive Components

• HiRel components from Kyocera AVX

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Power Electronics / Power Management

• Full telemetry in tiny DC-DC converters
• Multicell battery monitoring
• Power efficiency and robustness in electronics design
• Power IC supplies 1650 W

• USB Type-C-powered controllers
• Chokes rated at 36 A
• High-voltage contactors
• High-voltage step-down DC-DC converter
• New compact AC-DC PSU series

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Switches, Relays & Keypads

• High-voltage isolation reed relay

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Telecoms, Datacoms, Wireless, IoT

• GNSS antenna redefining what’s possible
• Innovative satellite navigation receiver
• LTE Cat 1 bis communication
• Quad-channel 16-bit converter
• Reference board for cardio monitoring
• Remote provisioning firmware added to SIMCom modules

• Smart module for multi-media devices
• Tactical navigation system
• u-blox expands NORA-B2 BLE modules
• 1 Mbit EEPROM with fast read/write capabilities
• 5G transparent antenna
• Danfoss radiator valve modification project demonstrates effectiveness of NeoMesh wireless mesh networking technology in smart buildings
• GNSS chipset for wearables

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Test & Measurement

• 14-bit AWG at 20 GS/s
• Additions to APD5000 series oscilloscopes

• hybridNETBOX instrumentation platform
• Handheld RTSA up to 9,5 GHz
• Latest wireless barcode scanner

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