The KOKI SB6NX58-G850 solder paste is a high-reliability, super low-voiding SMT soldering material engineered for demanding electronics assembly, especially in automotive and industrial applications where long service life and robust thermal performance are essential.
Formulated with a solid-solution-strengthened alloy of Sn-3.5Ag-0.5Bi-6.0In-0.8Cu, this paste delivers outstanding thermal-mechanical resistance. Solder joint deformation and crack propagation is reduced under thermal cycling stress. Its melting point of 202-204°C is lower than conventional SAC305, enabling reduced reflow temperatures and gentler thermal profiles on components and boards.
The G850 flux technology is designed to achieve stable super low-void solder joints, even with challenging components such as power transistors, QFNs, and BGAs, and across different PCB surface finishes. The combination of alloy and flux technologies not only optimises joint integrity, but also supports reliable soldering in production scenarios where void reduction and joint strength are priorities.
This solder paste is ideal for high-reliability SMT production where performance and long-term durability are critical.
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