31 August 2026Passive Components
Telecoms, Datacoms, Wireless, IoT
SGMICRO continues to add to its analogue IC portfolio at a steady pace, with new devices released across power protection, power conversion, current sensing and RF signal-chain categories.
Power protection: the SGM25135 is a 16 V hot-swap controller rated for 35 A with 1,1 mΩ RDSON, built as an Intelli-Fuse solution that lets a board or module be inserted onto a live power bus without inrush current or a fault downstream damaging other circuitry, useful in industrial control, telecom and server backplane designs.
Power conversion: the SGM62125 is a 3,5 A buck-boost converter with an I2C interface, able to regulate an output that sits above, below or equal to the input rail, well suited to single- or dual-cell Li-ion battery systems. Alongside it, the SGMM2130 is a synchronous 3D buck PowerSoC accepting 3 V to 17 V input for a 3 A output, integrating the inductor and passives into a single small power-module footprint.
Current sensing: the SGM8192-1 and SGM8181-1 are low- and high-side voltage-output current-sense amplifiers, with the SGM8181-1 adding bidirectional sensing, both aimed at battery management, motor drive and power-monitoring applications across industrial and EV designs.
RF: the SGM13005D1 is a low-noise amplifier for the sub-1 GHz band, aimed at improving receive sensitivity in LPWAN and other sub-GHz RF front ends, a useful complement to the sub-1 GHz wireless and metering designs already built around modules from Quectel, HOPERF and similar suppliers.
Harnessing Leakage Inductance Würth Electronics South Africa
Passive Components
Würth Electronics has expanded its WE-MCRI product series with the new 1090HL variant (HL = High Leakage), a coupled inductor specifically designed to improve the performance of SEPIC, ZETA and Cuk converters.
Read more...Wireless connectivity expanded iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Espressif Systems has introduced two new members of its ESP32 wireless SoC family: the ESP32-E22, the company’s first Wi-Fi 6E connectivity chip, and the ESP32-H21, an ultra-low-power Bluetooth LE microcontroller aimed at coin-cell and battery-powered devices.
Read more...Space saving SMD common-mode chokes Electrocomp
Passive Components
TDK Corporation presents the EP21 series of flat-wire double chokes designed for common-mode EMI filtering and available in an SMD format with dimensions of only 23,8 x 17,7 mm and heights ranging from 21,6 to 22,3 mm
Read more...Highly rugged GAPS and HAPS proximity sensors IOT Electronics
Passive Components
Now available through Powell Electronics are the GAPS (General Aerospace Proximity Sensors) and HAPS (Harsh Application Proximity Sensors) proximity sensors from Honeywell.
Read more...Quectel expands 5G portfolio iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel expands 5G portfolio with new Qualcomm- and UNISOC-based modules.
Read more...Understanding EMI Filters and their applications Vepac Electronics
Passive Components
Electromagnetic Interference (EMI) Filters are essential for maintaining electromagnetic compatibility (EMC), allowing multiple devices to function together without interference.
Read more...SMT flat-wire inductor
Passive Components
Würth Elektronik introduces its new WE-SFIA series of flat-wire inductors in 2010, 2013, and 2016 packages.
Read more...Compact SSI family for industrial automation Altron Arrow
Passive Components
Infineon Technologies has introduced the ISSI20BxxF Solid State Isolator (SSI) family, bringing solid-state isolation technology into high-volume applications traditionally served by photovoltaic isolators (PVIs), photovoltaic relays (PVRs), and electromechanical relays (EMRs).
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