USB solutions specialist Future Technology Devices International (FTDI) has further expanded its X-Chip series of USB-to-serial interface chips with the introduction of the ultra-compact FT234XD. Contained in a 3 x 3 mm 12-pin DFN package, the IC allows asynchronous serial data transfer at rates from 300 bps to 3 Mbps.
The device boasts low power consumption, typically drawing only 8 mA when active and 70 μm in suspend mode. Its built-in clock generation capability means that an external crystal is not required, and an optional clock output selection enables glue-less interfacing with the system microcontroller or FPGA.
The 512 Byte receive/transmit buffers, utilising buffer smoothing technology, markedly enhance data throughput. An integrated 2048 Byte multi-time-programmable (MTP) memory has also been included for storing device descriptors and carrying out CBUS I/O configuration.
The FT234XD’s sophisticated USB battery charger detection (BCD) mechanism enables USB peripheral devices to perceive connection to a higher rated power source, thereby facilitating more efficient charging. An operational temperature range of -40°C to +85°C allows the device to be specified for harsh working environments.
As all the USB protocol and I/O bridging is handled on the chip, there is no need for USB-specific firmware programming. When FTDI’s drivers are not supported in the native operating system, royalty-free Virtual Com Port (VCP) and D2XX drivers are available. Driver updates and maintenance are provided for the life of the product at no charge.
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