Telecoms, Datacoms, Wireless, IoT


Antenna-in-package 60 GHz transceiver system

3 April 2013 Telecoms, Datacoms, Wireless, IoT

Hittite has launched a new, highly integrated HMC6000LP711E/HMC6001LP711E antenna-in-package (AiP) silicon transceiver chipset solution, which is fabricated with silicon germanium (SiGe) BiCMOS semiconductor process technology and targets 60 GHz applications such as short-range Gbps data links, wireless sensors and test applications.

The HMC6000LP711E AiP solution combines a 60 GHz antenna with the HMC6000 transmitter IC while the HMC6001LP711E AiP solution combines a 60 GHz antenna with the HMC6001 receiver IC. Both transceivers are available in 7 x 11 mm QFN plastic packages which support low-cost surface mount PCB assembly and require no experience in handling millimetre-wave devices.

The chipset not only solves many of the key technical challenges encountered at millimetre-wave frequencies, but also enables turnkey multi-Gbps communication links at 60 GHz. Lower-frequency baseband signals are directly translated to and from 60 GHz, minimising the need for expensive and complex millimetre-wave interconnection components on the printed circuit board.

Both ICs provide an integrated frequency synthesiser for tuning across the 57 to 64 GHz band using 500 or 540 MHz steps (a quarter of the IEEE channel spacing) depending on the reference input frequency.

An RF antenna provides a low-loss RF transition to free space. Both devices provide a simple four-wire digital serial interface for full control and status reporting for these ICs, including frequency channel selection, gain control, circuit bias and filter bandwidths.

To facilitate evaluation of these transceiver ICs, Hittite offers the EKIT01-HMC6450, a complete 60 GHz AiP transceiver evaluation kit containing both the HMC6000LP711E transmitter and the HMC6001LP711E receiver.

Complete with configuration software, the kit provides the user with everything needed to set up a bidirectional millimetre-wave link at 60 GHz with a range of 4 metres. A universal analog I and Q interface will translate baseband analog I and Q signals with single-sided bandwidth out to 880 MHz and from the 60 GHz ISM band.

For more information contact Andrew Hutton, RF Design, +27 (0)21 555 8400, sales@rfdesign.co.za, www.rfdesign.co.za



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Wireless connectivity expanded
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
Espressif Systems has introduced two new members of its ESP32 wireless SoC family: the ESP32-E22, the company’s first Wi-Fi 6E connectivity chip, and the ESP32-H21, an ultra-low-power Bluetooth LE microcontroller aimed at coin-cell and battery-powered devices.

Read more...
Integrated X-band radar front-end module
RF Design Telecoms, Datacoms, Wireless, IoT
Qorvo has introduced an X-band radar front-end solution that enables defence system designers to achieve higher performance without increasing size, weight or prime power.

Read more...
Introducing Aurata
CST Electronics Telecoms, Datacoms, Wireless, IoT
Antenova has launched Aurata SR4L112: a compact, high efficiency embedded 4G/LTE antenna engineered for long, narrow PCB designs.

Read more...
Multi-constellation GNSS module in a legacy-compatible footprint
Altron Arrow Telecoms, Datacoms, Wireless, IoT
Telit Cinterion has announced the SE869eK2L, a single-frequency L1 GNSS module designed to help device manufacturers upgrade legacy positioning designs with improved performance and cost efficiency, while preserving design continuity.

Read more...
Quectel expands 5G portfolio
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
Quectel expands 5G portfolio with new Qualcomm- and UNISOC-based modules.

Read more...
Surface mount power amplifier for high-power applications
RF Design Power Electronics / Power Management
The GNA-63-5W+, from Mini-Circuits, is a GaN MMIC Power Amplifier (PA) designed for demanding RF applications requiring high efficiency, excellent linearity, and a compact footprint.

Read more...
Compact RTK design: More than just the receiver
iCorp Technologies Editor's Choice Telecoms, Datacoms, Wireless, IoT
In practice, engineers building compact RTK products keep discovering the same thing: the hardest component in the system is no longer the receiver. It is the antenna.

Read more...
Microchip advances Space-Grade timing performance
ASIC Design Services Telecoms, Datacoms, Wireless, IoT
Microchip Technology has expanded its atomic clock portfolio with the radiation-tolerant Space CSAC-SA65, a Chip Scale Atomic Clock designed to deliver precise timing for space systems.

Read more...
Channel emulator for 6 G and Wi-Fi 7/8
Concilium Technologies Telecoms, Datacoms, Wireless, IoT
With 400 MHz instantaneous bandwidth and support for carrier frequencies up to 23,6 GHz, Vertex 6.0 is the industry’s first channel emulator designed for next generation 6 G and Wi-Fi 7/8 testing.

Read more...
Secure, low-power Bluetooth LE SoC
NuVision Electronics Telecoms, Datacoms, Wireless, IoT
Silicon Labs unveils BG2B, its lowest-power Bluetooth LE SoC with industry-leading power efficiency, security, and integration.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved