Telecoms, Datacoms, Wireless, IoT


Antenna-in-package 60 GHz transceiver system

3 April 2013 Telecoms, Datacoms, Wireless, IoT

Hittite has launched a new, highly integrated HMC6000LP711E/HMC6001LP711E antenna-in-package (AiP) silicon transceiver chipset solution, which is fabricated with silicon germanium (SiGe) BiCMOS semiconductor process technology and targets 60 GHz applications such as short-range Gbps data links, wireless sensors and test applications.

The HMC6000LP711E AiP solution combines a 60 GHz antenna with the HMC6000 transmitter IC while the HMC6001LP711E AiP solution combines a 60 GHz antenna with the HMC6001 receiver IC. Both transceivers are available in 7 x 11 mm QFN plastic packages which support low-cost surface mount PCB assembly and require no experience in handling millimetre-wave devices.

The chipset not only solves many of the key technical challenges encountered at millimetre-wave frequencies, but also enables turnkey multi-Gbps communication links at 60 GHz. Lower-frequency baseband signals are directly translated to and from 60 GHz, minimising the need for expensive and complex millimetre-wave interconnection components on the printed circuit board.

Both ICs provide an integrated frequency synthesiser for tuning across the 57 to 64 GHz band using 500 or 540 MHz steps (a quarter of the IEEE channel spacing) depending on the reference input frequency.

An RF antenna provides a low-loss RF transition to free space. Both devices provide a simple four-wire digital serial interface for full control and status reporting for these ICs, including frequency channel selection, gain control, circuit bias and filter bandwidths.

To facilitate evaluation of these transceiver ICs, Hittite offers the EKIT01-HMC6450, a complete 60 GHz AiP transceiver evaluation kit containing both the HMC6000LP711E transmitter and the HMC6001LP711E receiver.

Complete with configuration software, the kit provides the user with everything needed to set up a bidirectional millimetre-wave link at 60 GHz with a range of 4 metres. A universal analog I and Q interface will translate baseband analog I and Q signals with single-sided bandwidth out to 880 MHz and from the 60 GHz ISM band.

For more information contact Andrew Hutton, RF Design, +27 (0)21 555 8400, [email protected], www.rfdesign.co.za



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Wi-Fi 6/BLE module enables rapid development
Altron Arrow Telecoms, Datacoms, Wireless, IoT
Telit Cinterion has announced the WE310K6, a fully integrated, low-power module featuring dual-band, dual-stream Wi-Fi 6, and dual-mode Bluetooth/BLE.

Read more...
Low phase noise amplifier
RFiber Solutions Telecoms, Datacoms, Wireless, IoT
The MAAL-011158 from Macom is an easy-to-use low-phase noise amplifier that provides 12 dB of gain in a 32-lead QFN plastic package.

Read more...
Webinar: Enabling the digital transformation of IIoT with Bluetooth
Telecoms, Datacoms, Wireless, IoT
Key industrial use cases for Bluetooth will be reviewed, including the main performance requirements for Bluetooth in industrial applications, and the technical features available.

Read more...
Full sensor to cloud solution
CST Electronics Telecoms, Datacoms, Wireless, IoT
NeoCortec has demonstrated the seamless and rapid development of full sensor-to-cloud solutions using NeoMesh Click boards from MikroE and the IoTConnect cloud solution from Avnet.

Read more...
Long-range Wi-Fi HaLow module
TRX Electronics Telecoms, Datacoms, Wireless, IoT
One of Mouser’s newest products is the Morse Micro MM6108-MF08651-US Wi-Fi HaLow Module, which adheres to the IEEE 802.11ah standard.

Read more...
Quectel launches 3GPP NTN comms module
Quectel Wireless Solutions Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has announced the Quectel BG95-S5 3GPP non-terrestrial network (NTN) satellite communication module.

Read more...
SIMCom’s A7673x series
Otto Wireless Solutions Telecoms, Datacoms, Wireless, IoT
SIMCom recently released the A7673X series, a Cat.1 bis module based on the ASR1606 chipset, that supports wireless communication modes of LTE-FDD, with a maximum downlink rate of 10 Mbps and a maximum uplink rate of 5 Mbps.

Read more...
Accelerating the commercialisation of the 5G IoT markets
Altron Arrow Editor's Choice Telecoms, Datacoms, Wireless, IoT
Fibocom unveils Non-Terrestrial Networks (NTN) module MA510-GL, enabling satellite and cellular connectivity to IoT applications.

Read more...
SiP supports LTE/NB-IoT and GNSS
RF Design DSP, Micros & Memory
The nRF9151 from Nordic Semiconductor is an integrated System-in-Package that supports LTE-M/NB-IoT, DECT NR+ and GNSS services.

Read more...
Long-range connectivity module
Avnet Silica Telecoms, Datacoms, Wireless, IoT
Digi XBee XR 868 RF Modules support the deployment of long-range connectivity applications, and support point-to-point and mesh networking protocols.

Read more...