Würth Elektronik has widened its range of shielding materials with the introduction of new EMI contact fingers. The contact spring material of the WE-SECF series is made of copper-beryllium and gold plated. Therefore, they cannot corrode and have a very low resistance.
With their wide surface, the components discharge high-frequency interference to contacted housings or mass layers of adjacent PCBs at extremely low impedances. Embedded systems of all kinds can thus be installed touching each other or conductive housings cost-efficiently in smallest spaces. This saves assembly effort and costs in production. High temperatures and mechanical weight have no influence on the excellent connection properties of the contact fingers.
Fifteen different versions are currently available, at heights from 1,5 mm to 13,0 mm. The EMI contact springs can be equipped fully automatically on PCBs and are delivered in blister belts.
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