Samtec’s new LP Array (LPAM and LPAF series) supports high-speed applications that require reliable, high-pin-count solutions in a low-profile design. This most recent addition to the company’s line of high-density, open pin field arrays is available in 4 mm, 4,5 mm and 5 mm mated heights with up to 180 total pins in four- or six-row configurations.
The arrays feature a dual wipe contact system on a 1,27 x 1,27 mm pitch grid for maximum grounding and routing flexibility. Standard lead-free solder crimp terminations allow for ease of processing and a tin-lead solder crimp option is also available. Optional pick-and-place pads are available for automated placement on the PCB. Other pin counts, row counts and gold plating options are also available for additional design flexibility.
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