Interconnection


Open pin field connectors

24 July 2013 Interconnection

Samtec’s new LP Array (LPAM and LPAF series) supports high-speed applications that require reliable, high-pin-count solutions in a low-profile design. This most recent addition to the company’s line of high-density, open pin field arrays is available in 4 mm, 4,5 mm and 5 mm mated heights with up to 180 total pins in four- or six-row configurations.

The arrays feature a dual wipe contact system on a 1,27 x 1,27 mm pitch grid for maximum grounding and routing flexibility. Standard lead-free solder crimp terminations allow for ease of processing and a tin-lead solder crimp option is also available. Optional pick-and-place pads are available for automated placement on the PCB. Other pin counts, row counts and gold plating options are also available for additional design flexibility.

For more information contact Barry Culligan, Otto Marketing, +27 (0)11 791 1033, contact@otto.co.za, www.otto.co.za



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