Computer/Embedded Technology


Rugged PCI/104-Express SBC

19 February 2014 Computer/Embedded Technology

Diamond Systems has débuted Atlas, a rugged PCI/104-Express single board computer (SBC) based on Intel’s dual-core Cedar Trail N2800 CPU. Offering a speed of 1,86 GHz and hyperthreading technology that enables applications to run in parallel, the new board provides highly efficient processing.

The SBC combines Intel Atom CPU performance with a wealth of onboard I/O and a conduction cooled thermal solution at a competitive price. Its rugged design makes it highly reliable in harsh applications including industrial, on-vehicle and military environments.

Available I/O includes USB 2.0, RS-232/422/485, Gigabit Ethernet, SATA and digital I/O. Atlas supports I/O expansion with PCI-104, PCIe/104, PCI/104-Express and PCIe MiniCard I/O modules. It uses a high-speed expansion connector that supports most PCIe/104 I/O modules. This design helps keep the cost of the board low, while increasing the PCB area available for other I/O features.

Thanks to a dual-use PCIe MiniCard/mSATA socket, the board can accommodate newer I/O modules in the PCIe MiniCard form factor featuring Wi-Fi, Ethernet, analog I/O, digital I/O and CAN. These modules provide compact expandability without increasing the total height of the system. For rugged applications, mSATA disk modules up to 64 GB are available in SLC and MLC technologies and with wide temperature operation.

Atlas SBCs run Linux, Windows Embedded Standard 7 and Windows Embedded CE operating systems. A Linux software development kit is available with bootable images and drivers, enabling engineers to start a design project right out of the box.

Atlas was specifically designed for rugged applications, with an operating temperature range of -40°C to +75°C and onboard DDR3 SDRAM, as well as an integrated conduction cooling heat spreader and a high tolerance for shock and vibration.

The bottom-mounted heat spreader provides a convenient mounting platform for the board, reduces case interior temperatures for improved system reliability, and simplifies the installation of I/O modules and cables by eliminating interference from heatsinks.



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