Interconnection


Board-to-board compression contacts

12 March 2014 Interconnection

AVX has released a new series of ruggedised, single piece, ultra low profile (ULP) board-to-board compression contacts.

Providing full connector performance and functionality at the individual contact level, the 70-9155 contacts feature a sweeping beam design that enables vertical or horizontal mating and high force, gold-plated beryllium copper contacts that maximise reliability and signal integrity, enabling lifetimes of up to 1000 cycles.

Impervious to even extreme shock and vibration, the parts provide a rugged and reliable compression connection to the mating board and can be surface mounted to any position on a PCB. They are suitable for portable and handheld industrial devices, board-to-board power and signal connections, and ground connections between PCBs or housings.

Packaged on tape and reel for automated SMT placement, the 70-9155 series is rated for 3 A and -40°C to +125°C; voltage ratings for the individual contacts are dependent upon their placement. Currently comprised of two contacts, the 70-9155 series is available with nominal operating heights of 1,0 mm and 1,5 mm and with contact operating height ranges of 0,75–1,25 mm and 1,25–1,75 mm, respectively.

For more information contact Craig Gibbs, Avnet Kopp, +27 (0)11 319 8600, [email protected], www.avnet.co.za





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