Freescale Semiconductor has revealed its first plastic packaged devices designed specifically for harsh applications. The new MRFE6VP5150N/GN and MRFE6VP5300N/GN power amplifiers are the industry’s first >65:1 VSWR rated devices to be housed in over-moulded plastic packaging. Compared to ceramic RF packages, plastic packaging offers benefits not only in terms of cost, but also manufacturability and thermal impedance.
In harsh industrial environments, devices are required to not only survive, but perform optimally under varying voltages and operating conditions. With a survivability rating of >65:1 VSWR with simultaneous over-voltage and overdrive, the new chips are designed to thrive in these environments while delivering high system reliability and low maintenance costs. Target applications include FM broadcast, CO2 lasers for medical applications, and VHF and UHF base stations for public safety radio installations.
These new RF power LDMOS transistors support wide frequency range utilisation: from 1,8 and 600 MHz. The MRFE6VP5150 is capable of handling a load mismatch of >65:1 VSWR at 50 V d.c., 230 MHz at multiple phase angles; and is capable of 150 Watts CW operation. In addition, both devices incorporate integrated stability enhancements and integrated ESD protection circuitry.
Wi-Fi 6/BLE module enables rapid development Altron Arrow
Telecoms, Datacoms, Wireless, IoT
Telit Cinterion has announced the WE310K6, a fully integrated, low-power module featuring dual-band, dual-stream Wi-Fi 6, and dual-mode Bluetooth/BLE.
Read more...Low phase noise amplifier RFiber Solutions
Telecoms, Datacoms, Wireless, IoT
The MAAL-011158 from Macom is an easy-to-use low-phase noise amplifier that provides 12 dB of gain in a 32-lead QFN plastic package.
Read more...Full sensor to cloud solution CST Electronics
Telecoms, Datacoms, Wireless, IoT
NeoCortec has demonstrated the seamless and rapid development of full sensor-to-cloud solutions using NeoMesh Click boards from MikroE and the IoTConnect cloud solution from Avnet.
Read more...Long-range Wi-Fi HaLow module TRX Electronics
Telecoms, Datacoms, Wireless, IoT
One of Mouser’s newest products is the Morse Micro MM6108-MF08651-US Wi-Fi HaLow Module, which adheres to the IEEE 802.11ah standard.
Read more...Quectel launches 3GPP NTN comms module Quectel Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has announced the Quectel BG95-S5 3GPP non-terrestrial network (NTN) satellite communication module.
Read more...SIMCom’s A7673x series Otto Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
SIMCom recently released the A7673X series, a Cat.1 bis module based on the ASR1606 chipset, that supports wireless communication modes of LTE-FDD, with a maximum downlink rate of 10 Mbps and a maximum uplink rate of 5 Mbps.
Read more...General-purpose MCU with RISC-V architecture EBV Electrolink
DSP, Micros & Memory
Renesas has released a general-purpose MCU to enhance its existing RISC-V portfolio, and this is its first MCU using a RISC-V core developed internally at the company.
Read more...AI-native IoT platform launched EBV Electrolink
AI & ML
These highly-integrated Linux and Android SoCs from Synaptics are optimised for consumer, enterprise, and industrial applications and deliver an ‘out-of-the-box’ edge AI experience.