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High-speed DDR3 SDRAM
16 July 2014, DSP, Micros & Memory
Alliance Memory introduced a new line of high-speed CMOS double data rate 3 synchronous DRAMs (DDR3 SDRAM) and low-voltage DDR3L SDRAMs with densities of 1 Gb, 2 Gb and 4 Gb in 78-ball, 9 x 10,5 x 1,2 mm and 96-ball, 9 x 13 x 1,2 mm FBGA packages. With their double data rate architecture, they offer extremely fast transfer rates of up to 1600 Mbps/pin and clock rates of 800 MHz.
With minimal die shrinks, the company’s DDR3 (1,5 V) and DDR3L (1,35 V) SDRAMs provide reliable drop-in, pin-for-pin-compatible replacements for a number of similar solutions used in conjunction with newer-generation microprocessors for industrial, consumer and telecom applications, eliminating the need for costly redesigns and part requalification.
The AS4C64M16D3, AS4C128M8D3, AS4C128M16D3, AS4C256M8D3, AS4C256M16D3 and AS4C512M8D3 operate from a single +1,5 V power supply, while the AS4C64M16D3L, AS4C128M8D3L, AS4C128M16D3L, AS4C256M8D3L, AS4C256M16D3L and AS4C512M8D3L operate from a single +1,35 V power supply. The devices are offered with a commercial temperature range of 0°C to +95°C and an industrial temperature range of -40°C to +95°C.
The chips are internally configured as eight banks of 64M, 128M, 256M and 512M x 8 bits and/or 16 bits. They offer fully synchronous operation and provide programmable read or write burst lengths of 4 or 8. An auto precharge function provides a self-timed row precharge initiated at the end of the burst sequence.
Easy-to-use refresh functions include auto- or self-refresh, and a programmable mode register allows the system to choose the most suitable modes to maximise performance. |
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Further reading:
- Mixed-signal MCUs for digital power
26 June 2019, EBV Electrolink, DSP, Micros & Memory
Targeted at advanced digital power applications and consumer and industrial appliances, the new STM32G4 microcontrollers (MCUs) introduce two new hardware mathematical accelerators to boost processing ...
- Memory IC combines NAND and LPDDR
26 June 2019, iCorp Technologies, DSP, Micros & Memory
The new W71NW20KK1KW from Winbond, which combines robust single level cell (SLC) NAND Flash and high-speed, low-power LPDDR4x memory, provides sufficient memory capacity for 5G cellular modems that are ...
- Flash memories with embedded MAC addresses
26 June 2019, Avnet South Africa, DSP, Micros & Memory
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- Dual- and single-core DSCs
29 May 2019, Avnet South Africa, DSP, Micros & Memory
New dual- and single-core dsPIC33C digital signal controllers (DSCs) have been released by Microchip Technology, with more options to meet changing application requirements across memory, temperature ...
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29 May 2019, Altron Arrow, DSP, Micros & Memory
STMicroelectronics is applying its Arm Cortex expertise to expand the capabilities of its STM32 microcontroller (MCU) portfolio to applications requiring even more performance, resources and large open-source ...
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29 May 2019, EBV Electrolink, DSP, Micros & Memory
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- MCUs with water-tolerant touch integration
29 May 2019, EBV Electrolink, DSP, Micros & Memory
The 5 V KE1xZ family of microcontrollers (MCU), made by NXP Semiconductor and based on the Arm Cortex M0+, enables embedded control systems in harsh electrical environments, with an integrated CAN controller, ...
- Wi-Fi microcontroller
29 May 2019, iCorp Technologies, DSP, Micros & Memory, Switches, Relays & Keypads
The ESP32-S2 from Espressif Systems is a highly integrated, low-power, 2,4 GHz Wi-Fi microcontroller SoC (system-on-chip) supporting Wi-Fi HT40 and 43 general-purpose I/Os. Based on an Xtensa single-core ...
- DSCs with USB and CAN FD support
29 May 2019, EBV Electrolink, DSP, Micros & Memory
NXP Semiconductors’ MC56F83xxx digital signal controllers (DSC) family offers peripheral enhancements ideal for high-performance digital power conversion and advanced motor control applications.
The ...
- MCUs for touch-free UI
30 April 2019, Hi-Q Electronics, DSP, Micros & Memory
Renesas Electronics introduced two touch-free user interface (UI) solutions to simplify the design of 2D and 3D control-based applications. Based on the company’s capacitive sensor microcontrollers (MCUs), ...
- MCUs with water-tolerant touch integration
30 April 2019, EBV Electrolink, DSP, Micros & Memory
The 5 V KE1xZ family of microcontrollers (MCU), made by NXP Semiconductor and based on the Arm Cortex M0+, enables embedded control systems in harsh electrical environments, with an integrated CAN controller, ...
- MCUs for industrial IoT endpoints
27 March 2019, Hi-Q Electronics, DSP, Micros & Memory
Renesas Electronics’ new highly integrated S5D3 MCUs (microcontrollers) simplify application development with their secure cryptographic engine and Synergy software package. Equipped with advanced security, ...
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