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Electronics Buyers' Guide

Electronics Manufacturing & Production Handbook 2019


 

High-speed DDR3 SDRAM
16 July 2014, DSP, Micros & Memory

Alliance Memory introduced a new line of high-speed CMOS double data rate 3 synchronous DRAMs (DDR3 SDRAM) and low-voltage DDR3L SDRAMs with densities of 1 Gb, 2 Gb and 4 Gb in 78-ball, 9 x 10,5 x 1,2 mm and 96-ball, 9 x 13 x 1,2 mm FBGA packages. With their double data rate architecture, they offer extremely fast transfer rates of up to 1600 Mbps/pin and clock rates of 800 MHz.

With minimal die shrinks, the company’s DDR3 (1,5 V) and DDR3L (1,35 V) SDRAMs provide reliable drop-in, pin-for-pin-compatible replacements for a number of similar solutions used in conjunction with newer-generation microprocessors for industrial, consumer and telecom applications, eliminating the need for costly redesigns and part requalification.

The AS4C64M16D3, AS4C128M8D3, AS4C128M16D3, AS4C256M8D3, AS4C256M16D3 and AS4C512M8D3 operate from a single +1,5 V power supply, while the AS4C64M16D3L, AS4C128M8D3L, AS4C128M16D3L, AS4C256M8D3L, AS4C256M16D3L and AS4C512M8D3L operate from a single +1,35 V power supply. The devices are offered with a commercial temperature range of 0°C to +95°C and an industrial temperature range of -40°C to +95°C.

The chips are internally configured as eight banks of 64M, 128M, 256M and 512M x 8 bits and/or 16 bits. They offer fully synchronous operation and provide programmable read or write burst lengths of 4 or 8. An auto precharge function provides a self-timed row precharge initiated at the end of the burst sequence.

Easy-to-use refresh functions include auto- or self-refresh, and a programmable mode register allows the system to choose the most suitable modes to maximise performance.


Credit(s)
Supplied By: KH Distributors
Tel: +27 11 854 5011
Fax: 086 694 8250
Email: sales@khd.co.za
www: www.khd.co.za
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Further reading:

  • Mixed-signal MCUs for digital power
    26 June 2019, EBV Electrolink, DSP, Micros & Memory
    Targeted at advanced digital power applications and consumer and industrial appliances, the new STM32G4 microcontrollers (MCUs) introduce two new hardware mathematical accelerators to boost processing ...
  • Memory IC combines NAND and LPDDR
    26 June 2019, Icorp Technologies, DSP, Micros & Memory
    The new W71NW20KK1KW from Winbond, which combines robust single level cell (SLC) NAND Flash and high-speed, low-power LPDDR4x memory, provides sufficient memory capacity for 5G cellular modems that are ...
  • Flash memories with embedded MAC addresses
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  • Dual- and single-core DSCs
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  • DSCs with USB and CAN FD support
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  • MCUs for touch-free UI
    30 April 2019, Hi-Q Electronics, DSP, Micros & Memory
    Renesas Electronics introduced two touch-free user interface (UI) solutions to simplify the design of 2D and 3D control-based applications. Based on the company’s capacitive sensor microcontrollers (MCUs), ...
  • MCUs with water-tolerant touch integration
    30 April 2019, EBV Electrolink, DSP, Micros & Memory
    The 5 V KE1xZ family of microcontrollers (MCU), made by NXP Semiconductor and based on the Arm Cortex M0+, enables embedded control systems in harsh electrical environments, with an integrated CAN controller, ...
  • MCUs for industrial IoT endpoints
    27 March 2019, Hi-Q Electronics, DSP, Micros & Memory
    Renesas Electronics’ new highly integrated S5D3 MCUs (microcontrollers) simplify application development with their secure cryptographic engine and Synergy software package. Equipped with advanced security, ...

 
 
         
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