16 July 2014Manufacturing / Production Technology, Hardware & Services
Nikon Metrology’s latest XT V 160 NF is a high-precision, flat-panel based X-ray inspection system that facilitates real-time imaging and defect analysis of next-generation wafer-level, semiconductor device and PCBA (printed circuit board assembly) applications.
The system’s NanoFocus source with nanoscale X-ray spot size, high-precision manipulator and 3 megapixel flat panel detector with high dynamic range results in feature recognition capability below 0,1 μm. The large 580 x 580 mm tray enables the possibility to inspect large PCBAs, multiple components or pallets, coupled with advanced automated software capabilities.
The machine features a 360° continuous rotate detector axis which enables oblique angle views of up to 60° to the centre of the detector panel. The system offers intelligent region-of-interest lock, which maintains feature view with changing magnification or angle view.
Thanks to the highly accurate and precise anti-vibration sample manipulator, the NF system is ready for next-generation laminography inspection techniques with advanced cross sectional view capability to detect defects as small as a few microns. It provides a method of inspecting a region of interest which can be challenging to inspect with 2D radiography, such as 3D stack dies, BGA pad cracks or multilayer boards, without the need to rotate the sample or cut it down in size.
The system is equipped with Inspect-X 4 acquisition and analysis software focusing on improved usability and productivity. The software facilitates real-time inspection as well as the creation of automated programs via a user-friendly graphical user interface.
Productivity is increased by offering intuitive operator control, fast creation of inspection programs and robust image inspection algorithms. The new range of intelligent inspection tools features enhanced image processing offering advanced BGA and wire sweep analysis to analyse the most challenging electronics boards and components
Outscale your competition
Manufacturing / Production Technology, Hardware & Services
Attendees will be able to explore the benefits of AMD Kintex UltraScale+ Gen 2 FPGAs in high-performance Pro AV, test & measurement, industrial, and medical applications.
Read more...MTN SA Foundation drives youth pathways into the digital economy
Manufacturing / Production Technology, Hardware & Services
The MTN SA Foundation, in partnership with Helios Towers and Datacomb Development Hub, has launched the MTN–Helios Towers 12-month ICT Learnership Programme, a pathway that takes young South Africans from digital training into real workplace experience.
Read more...The impact of harsh environments and ionic contamination on post-reflow circuit assemblies MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.
Read more...Engineering copper grain structure for high-yield hybrid bonding in 3D packaging Testerion
Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.
Read more...Understanding solder dross: causes and control strategies Truth Electronic Manufacturing
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.
Read more...Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.
Read more...The causes of solder balls in robotic soldering
Manufacturing / Production Technology, Hardware & Services
Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.
Read more...Material challenges for superconducting quantum chips
Manufacturing / Production Technology, Hardware & Services
To achieve the scalable and repeatable production of superconducting circuits for quantum technology products, players in the industry are leveraging semiconductor fabrication techniques.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version