Manufacturing / Production Technology, Hardware & Services


X-ray inspection system

16 July 2014 Manufacturing / Production Technology, Hardware & Services

Nikon Metrology’s latest XT V 160 NF is a high-precision, flat-panel based X-ray inspection system that facilitates real-time imaging and defect analysis of next-generation wafer-level, semiconductor device and PCBA (printed circuit board assembly) applications.

The system’s NanoFocus source with nanoscale X-ray spot size, high-precision manipulator and 3 megapixel flat panel detector with high dynamic range results in feature recognition capability below 0,1 μm. The large 580 x 580 mm tray enables the possibility to inspect large PCBAs, multiple components or pallets, coupled with advanced automated software capabilities.

The machine features a 360° continuous rotate detector axis which enables oblique angle views of up to 60° to the centre of the detector panel. The system offers intelligent region-of-interest lock, which maintains feature view with changing magnification or angle view.

Thanks to the highly accurate and precise anti-vibration sample manipulator, the NF system is ready for next-generation laminography inspection techniques with advanced cross sectional view capability to detect defects as small as a few microns. It provides a method of inspecting a region of interest which can be challenging to inspect with 2D radiography, such as 3D stack dies, BGA pad cracks or multilayer boards, without the need to rotate the sample or cut it down in size.

The system is equipped with Inspect-X 4 acquisition and analysis software focusing on improved usability and productivity. The software facilitates real-time inspection as well as the creation of automated programs via a user-friendly graphical user interface.

Productivity is increased by offering intuitive operator control, fast creation of inspection programs and robust image inspection algorithms. The new range of intelligent inspection tools features enhanced image processing offering advanced BGA and wire sweep analysis to analyse the most challenging electronics boards and components



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