16 July 2014Manufacturing / Production Technology, Hardware & Services
SolderStar’s innovative APS (Automatic Profiling System) uses the latest evolution of reflow data logger to provide a full time process monitoring solution capable of providing a profile for every board soldered in a convection reflow oven, in a single hardware platform. Shortly after its release, the company announced that it had already sold APS equipment to two leading European manufacturers following successful testing.
The system is tailored for, and fitted to, a customer’s oven so their requirements are met precisely. Special temperature probes are mounted along the heated length on both sides of the machine to monitor actual product-level temperatures in real time. In addition to this the system keeps track of the current speed and position of each assembly in the process. Where barcoding is available, it will also integrate with internal enterprise resource planning (ERP) systems to provide automatic storage of PCB data from the production lines.
The system uses small temperature probes which can be positioned close to the PCB to ensure highly accurate temperature measurement in the vicinity of the electronic assembly during soldering. The smaller size also reduces the danger of the probe shadowing the product.
SolderStar APS has been designed to include a sophisticated computer algorithm which uses a reference profile, captured once from a traditional profiling system along with live readings from the process to calculate a mathematical profile for each PCB exiting the oven. The system allows thorough checking of temperature profiles, an automatic analysis of the profile, and checking of production parameters against production limits.
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