Lattice Semiconductor announced volume production of its MachXO3L FPGA family in four tiny packages as small as 2,5 x 2,5 mm. Also launched were two new low-cost breakout boards that enable designers to evaluate the devices’ hard IP, versatile I/O and other capabilities.
The product family boasts low cost per I/O enabled by wafer-level chip-scale (WLCSP) and advanced chip-array BGA (caBGA) technology with package sizes as small as 2,5 x 2,5 mm and having up to 335 I/O in a 17 x 17 mm package. These enable engineers to fit big functionality in tiny spaces while maintaining cost competitiveness in applications as diverse as industrial infrastructure and smart connected devices.
MachXO3L devices integrate an onboard regulator to simplify system design, eliminate thermal constraints and help engineers realise power efficient, always-on devices. Instant-on capability with boot-up time of less than 1 ms, coupled with background system upgrade capability, dual boot and a single supply, makes them ideal for controlling bring-up and system initialisation.
The chips provide hardened IP blocks including I²C, SPI, embedded memory and an oscillator, all in an instant-on programmable fabric. They also support MIPI D-Phy based DSI and CSI2 I/O.
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