Interconnection


High-density interposers

1 July 2015 Interconnection

Samtec has added 1,00 mm pitch arrays (ZA1 Series) to its Z-Ray product line, offering a choice between dual compression contacts or single compression with solder balls.

These one piece arrays are ultra-low profile, high density and highly customisable, and are used as interposers or as board level interconnects. They feature X-Y-Z axes flexibility, customisable shapes and patterns, entended cycle life, low normal force with high deflection range and 28+ Gbps performance.

With up to 400 total BeCu micro-formed contacts, the arrays feature low 25 g normal force with 0,20 mm contact deflection. Z-Ray is a one piece design assembled into a rugged single-layer FR4 substrate to achieve a 1,00 mm stack height. Screw-down and alignment holes are standard for use with press fit alignment hardware (ZD/ZSO/ZHSI Series) for precise alignment, compression and retention.

A variety of custom capabilities are available, including the overall shape of the interposer, multiple pitches, higher pin counts in any pattern and stack heights from 0,305 mm to 4 mm. Design flexibility also includes features such as latches, thermal spreaders and quick-release spring constraints for more rugged applications. Quick-turn customisations are available and require minimal NRE and tooling charges. A customisable interposer with multi-layer FR4, for pitch spreaders and other embedded interconnect circuitry, is in development.

The Z-Ray family of interposers includes a 0,80 mm pitch array (ZA8 Series) for micro pitch applications. In development is a 0,80 mm pitch #34 AWG twinax cable system (ZRDP/ZCI/ZCC Series) in an ultra-low profile design with mating micro inter-poser and rugged metal cage.



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