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Electronics Buyers' Guide

Electronics Manufacturing & Production Handbook 2019


 

Legacy Micron SDRAMs available through 2017
22 July 2015, DSP, Micros & Memory

Alliance Memory announced that its 32M x 16 MT48LC32M16A2P-75: C (commercial temperature), 32M x 16 MT48LC32M16A2P-75 IT:C (industrial temperature), 64M x 8 MT48LC64M8A2P-75:C (commercial temperature) and 64M x 8 MT48LC64M8A2P-75 IT:C (industrial temperature) synchronous DRAM (SDRAM) devices, which the company recently acquired from Micron Semiconductor, will be available with their original Micron part numbers into 2017. In addition to making this commitment, Alliance has already begun its own design, which will be ready in 2016.

The 512 Mb devices are optimised for medical, industrial, automotive and telecom applications requiring high memory bandwidth, and are particularly well suited to high-performance PC applications. Offered in a 54-pin TSOP II package and available with commercial (0°C to +70°C) and industrial (-40°C to +85&dC) temperature ranges, they operate from a single 3,3 V power supply and are lead- and halogen-free.

PC100- and PC133-compliant, the chips provide programmable read or write burst lengths of 1, 2, 4, 8 or full page, with a burst termination option. An auto pre-charge function provides a self-timed row pre-charge initiated at the end of the burst sequence. Easy-to-use refresh functions include auto- or self-refresh, while a programmable mode register allows the system to choose the most suitable modes to maximise performance.


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Supplied By: KH Distributors
Tel: +27 11 854 5011
Fax: 086 694 8250
Email: sales@khd.co.za
www: www.khd.co.za
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Further reading:

  • Mixed-signal MCUs for digital power
    26 June 2019, EBV Electrolink, DSP, Micros & Memory
    Targeted at advanced digital power applications and consumer and industrial appliances, the new STM32G4 microcontrollers (MCUs) introduce two new hardware mathematical accelerators to boost processing ...
  • Memory IC combines NAND and LPDDR
    26 June 2019, iCorp Technologies, DSP, Micros & Memory
    The new W71NW20KK1KW from Winbond, which combines robust single level cell (SLC) NAND Flash and high-speed, low-power LPDDR4x memory, provides sufficient memory capacity for 5G cellular modems that are ...
  • Flash memories with embedded MAC addresses
    26 June 2019, Avnet South Africa, DSP, Micros & Memory
    Microchip Technology’s SST26VF Serial Quad I/O (SQI) 3 V Flash family is the industry’s first NOR Flash devices to offer integrated MAC address options. Pre-programmed with EUI-48 and EUI-64 addresses, ...
  • Dual- and single-core DSCs
    29 May 2019, Avnet South Africa, DSP, Micros & Memory
    New dual- and single-core dsPIC33C digital signal controllers (DSCs) have been released by Microchip Technology, with more options to meet changing application requirements across memory, temperature ...
  • MPUs for open-source software-based designs
    29 May 2019, Altron Arrow, DSP, Micros & Memory
    STMicroelectronics is applying its Arm Cortex expertise to expand the capabilities of its STM32 microcontroller (MCU) portfolio to applications requiring even more performance, resources and large open-source ...
  • MCUs for advanced security and physical protection
    29 May 2019, EBV Electrolink, DSP, Micros & Memory
    The new K32 microcontroller (MCU) series from NXP Semiconductors is optimised for energy efficiency in real-time embedded applications, and enables advanced security with physical tamper protection in ...
  • MCUs with water-tolerant touch integration
    29 May 2019, EBV Electrolink, DSP, Micros & Memory
    The 5 V KE1xZ family of microcontrollers (MCU), made by NXP Semiconductor and based on the Arm Cortex M0+, enables embedded control systems in harsh electrical environments, with an integrated CAN controller, ...
  • Wi-Fi microcontroller
    29 May 2019, iCorp Technologies, DSP, Micros & Memory, Switches, Relays & Keypads
    The ESP32-S2 from Espressif Systems is a highly integrated, low-power, 2,4 GHz Wi-Fi microcontroller SoC (system-on-chip) supporting Wi-Fi HT40 and 43 general-purpose I/Os. Based on an Xtensa single-core ...
  • DSCs with USB and CAN FD support
    29 May 2019, EBV Electrolink, DSP, Micros & Memory
    NXP Semiconductors’ MC56F83xxx digital signal controllers (DSC) family offers peripheral enhancements ideal for high-performance digital power conversion and advanced motor control applications. The ...
  • MCUs for touch-free UI
    30 April 2019, Hi-Q Electronics, DSP, Micros & Memory
    Renesas Electronics introduced two touch-free user interface (UI) solutions to simplify the design of 2D and 3D control-based applications. Based on the company’s capacitive sensor microcontrollers (MCUs), ...
  • MCUs with water-tolerant touch integration
    30 April 2019, EBV Electrolink, DSP, Micros & Memory
    The 5 V KE1xZ family of microcontrollers (MCU), made by NXP Semiconductor and based on the Arm Cortex M0+, enables embedded control systems in harsh electrical environments, with an integrated CAN controller, ...
  • MCUs for industrial IoT endpoints
    27 March 2019, Hi-Q Electronics, DSP, Micros & Memory
    Renesas Electronics’ new highly integrated S5D3 MCUs (microcontrollers) simplify application development with their secure cryptographic engine and Synergy software package. Equipped with advanced security, ...

 
 
         
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